Micronics Japan Co (TSE:6871) Change In Receivables : 円0 Mil (TTM As of Mar. 2024)

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What is Micronics Japan Co Change In Receivables?

Micronics Japan Co's change in receivables for the quarter that ended in Mar. 2024 was 円0 Mil. It means Micronics Japan Co's Accounts Receivable stayed the same from Dec. 2023 to Mar. 2024 .

Micronics Japan Co's change in receivables for the fiscal year that ended in Dec. 2022 was 円2,273 Mil. It means Micronics Japan Co's Accounts Receivable declined by 円2,273 Mil from Dec. 2021 to Dec. 2022 .

Micronics Japan Co's Accounts Receivable for the quarter that ended in Mar. 2024 was 円7,238 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. Micronics Japan Co's Days Sales Outstanding for the three months ended in Mar. 2024 was 56.00.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. Micronics Japan Co's liquidation value for the three months ended in Mar. 2024 was 円11,911 Mil.

Micronics Japan Co Change In Receivables Historical Data

The historical data trend for Micronics Japan Co's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Micronics Japan Co Change In Receivables Chart

Micronics Japan Co Annual Data

Trend

Sep13

Sep14

Sep15

Sep16

Sep17

Sep18

Sep19

Sep20

Dec21

Dec22

Change In Receivables

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823.00

1,758.00

-590.00

-2,676.00

2,273.00

Micronics Japan Co Quarterly Data
	Mar19	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Change In Receivables	Get a 7-Day Free Trial															-	-	-	-	-

Micronics Japan Co Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was 円0 Mil.

Micronics Japan Co (TSE:6871) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

Micronics Japan Co's Days Sales Outstanding for the quarter that ended in Mar. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	7238	/	11794	*	91
=	56.00

2. In Ben Graham's calculation of liquidation value, Micronics Japan Co's accounts receivable are only considered to be worth 75% of book value:

Micronics Japan Co's liquidation value for the quarter that ended in Mar. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	19045	-	16748	+	0.75 * 7238	+	0.5 * 8370
=	11,911

Micronics Japan Co Change In Receivables Related Terms

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Micronics Japan Co (TSE:6871) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Micronics Japan Co Ltd (TSE:6871) » Definitions » Change In Receivables

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MJ3:Germany

Address

2-6-8 Kichijoji Hon-cho, Musashino-shi, Tokyo, JPN, 180 8508

Website

http://www.mjc.co.jp

Micronics Japan Co Ltd is a Japanese company which is engaged in manufacturing of semiconductor and related products. It mainly produces probe cards for testing the electrical properties of wafers, testing equipment and test sockets for property testing after packaging, and a wafer prober, which is used for evaluation and analysis of devices. The company also offers products such as array probers, which are used for testing the electrical properties of flat panel displays (FDP), automated optical inspection equipment used for the display inspection of panels, and probe units that send electrical signals to test panels. Its product portfolio includes probe cards, package probe, semiconductor test equipment, automated optical inspection equipment, probe units, and FDP prober products.

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