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Micronics Japan Co (TSE:6871) Total Liabilities : 円30,344 Mil (As of Dec. 2024)


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What is Micronics Japan Co Total Liabilities?

Micronics Japan Co's Total Liabilities for the quarter that ended in Dec. 2024 was 円30,344 Mil.

Micronics Japan Co's quarterly Total Liabilities increased from Jun. 2024 (円18,817.00 Mil) to Sep. 2024 (円21,792.00 Mil) and increased from Sep. 2024 (円21,792.00 Mil) to Dec. 2024 (円30,344.00 Mil).

Micronics Japan Co's annual Total Liabilities declined from Dec. 2021 (円16,679.00 Mil) to Dec. 2022 (円15,754.00 Mil) and declined from Dec. 2022 (円15,754.00 Mil) to Dec. 2023 (円14,649.00 Mil).


Micronics Japan Co Total Liabilities Historical Data

The historical data trend for Micronics Japan Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Micronics Japan Co Total Liabilities Chart

Micronics Japan Co Annual Data
Trend Sep14 Sep15 Sep16 Sep17 Sep18 Sep19 Sep20 Dec21 Dec22 Dec23
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 11,419.00 13,445.00 16,679.00 15,754.00 14,649.00

Micronics Japan Co Quarterly Data
Dec19 Mar20 Jun20 Sep20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 14,649.00 16,748.00 18,817.00 21,792.00 30,344.00

Micronics Japan Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Micronics Japan Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=12085+(372+65
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+2127+0)
=14,649

Total Liabilities=Total Assets (A: Dec. 2023 )-Total Equity (A: Dec. 2023 )
=55849-41200
=14,649

Micronics Japan Co's Total Liabilities for the quarter that ended in Dec. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=27612+(439+148
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit+NonCurrent Deferred Income Tax)
+0+2145+0)
=30,344

Total Liabilities=Total Assets (Q: Dec. 2024 )-Total Equity (Q: Dec. 2024 )
=79990-49646
=30,344

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Micronics Japan Co Total Liabilities Related Terms

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Micronics Japan Co Business Description

Traded in Other Exchanges
Address
2-6-8 Kichijoji Hon-cho, Musashino-shi, Tokyo, JPN, 180 8508
Micronics Japan Co Ltd is a Japanese company which is engaged in manufacturing of semiconductor and related products. It mainly produces probe cards for testing the electrical properties of wafers, testing equipment and test sockets for property testing after packaging, and a wafer prober, which is used for evaluation and analysis of devices. The company also offers products such as array probers, which are used for testing the electrical properties of flat panel displays (FDP), automated optical inspection equipment used for the display inspection of panels, and probe units that send electrical signals to test panels. Its product portfolio includes probe cards, package probe, semiconductor test equipment, automated optical inspection equipment, probe units, and FDP prober products.

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