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AIIXY (Aixtron SE) Issuance of Debt : $0.0 Mil (TTM As of Dec. 2024)


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What is Aixtron SE Issuance of Debt?

Aixtron SE's Issuance of Debt for the three months ended in Dec. 2024 was $0.0 Mil.

Aixtron SE's Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 was $0.0 Mil.


Aixtron SE Issuance of Debt Historical Data

The historical data trend for Aixtron SE's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Aixtron SE Issuance of Debt Chart

Aixtron SE Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Issuance of Debt
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Aixtron SE Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
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Aixtron SE Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was $0.0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Aixtron SE Issuance of Debt Related Terms

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Aixtron SE Business Description

Address
Dornkaulstrasse 2, Herzogenrath, NW, DEU, 52134
Aixtron SE is a provider of deposition equipment to the semiconductor industry. The company's technology solutions are used by a diverse range of customers to build components for electronic and optoelectronic applications based on compound, silicon, or organic semiconductor materials. Its components are used in displays, signaling, lighting, fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, as well as in other applications. Business operation of the group can be seen in the market of Germany, the USA, Korea, China, Taiwan, Japan, and Malaysia.

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