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Hefei Chipmore Technology Co (SHSE:688352) Debt-to-Revenue : 0.26 (As of Mar. 2024)


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What is Hefei Chipmore Technology Co Debt-to-Revenue?

Debt-to-Revenue measures a company's ability to pay off its debt.

Hefei Chipmore Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥168 Mil. Hefei Chipmore Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥286 Mil. Hefei Chipmore Technology Co's annualized Revenue for the quarter that ended in Mar. 2024 was ¥1,774 Mil. Hefei Chipmore Technology Co's annualized Debt-to-Revenue for the quarter that ended in Mar. 2024 was 0.26.


Hefei Chipmore Technology Co Debt-to-Revenue Historical Data

The historical data trend for Hefei Chipmore Technology Co's Debt-to-Revenue can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Hefei Chipmore Technology Co Debt-to-Revenue Chart

Hefei Chipmore Technology Co Annual Data
Trend Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Revenue
1.30 1.13 0.94 0.87 0.40

Hefei Chipmore Technology Co Quarterly Data
Dec19 Dec20 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Revenue Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.84 0.49 0.39 0.34 0.26

Competitive Comparison of Hefei Chipmore Technology Co's Debt-to-Revenue

For the Semiconductor Equipment & Materials subindustry, Hefei Chipmore Technology Co's Debt-to-Revenue, along with its competitors' market caps and Debt-to-Revenue data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Hefei Chipmore Technology Co's Debt-to-Revenue Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Hefei Chipmore Technology Co's Debt-to-Revenue distribution charts can be found below:

* The bar in red indicates where Hefei Chipmore Technology Co's Debt-to-Revenue falls into.



Hefei Chipmore Technology Co Debt-to-Revenue Calculation

Debt-to-Revenue measures a company's ability to pay off its debt.

Hefei Chipmore Technology Co's Debt-to-Revenue for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(343.574 + 309.189) / 1629.34
=0.40

Hefei Chipmore Technology Co's annualized Debt-to-Revenue for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(168.489 + 285.551) / 1773.62
=0.26

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-Revenue, the Revenue of the last fiscal year is used. In calculating the annualized quarterly data, the Revenue data used here is four times the quarterly (Mar. 2024) Revenue data.


Hefei Chipmore Technology Co Debt-to-Revenue Related Terms

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Hefei Chipmore Technology Co (SHSE:688352) Business Description

Traded in Other Exchanges
N/A
Address
Comprehensive Free Trade Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230011
Hefei Chipmore Technology Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It can provide customers with a full range of comprehensive integrated circuit packaging and testing services, covering display driver chips, power management chips, RF front-end chips and other products.
Executives
Wang Xiao Feng Core technical personnel

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