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Hefei Chipmore Technology Co (SHSE:688352) EBITDA Margin % : 21.17% (As of Mar. 2024)


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What is Hefei Chipmore Technology Co EBITDA Margin %?

EBITDA Margin % is calculated as EBITDA divided by its Revenue. Hefei Chipmore Technology Co's EBITDA for the three months ended in Mar. 2024 was ¥94 Mil. Hefei Chipmore Technology Co's Revenue for the three months ended in Mar. 2024 was ¥443 Mil. Therefore, Hefei Chipmore Technology Co's EBITDA margin for the quarter that ended in Mar. 2024 was 21.17%.


Hefei Chipmore Technology Co EBITDA Margin % Historical Data

The historical data trend for Hefei Chipmore Technology Co's EBITDA Margin % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Hefei Chipmore Technology Co EBITDA Margin % Chart

Hefei Chipmore Technology Co Annual Data
Trend Dec19 Dec20 Dec21 Dec22 Dec23
EBITDA Margin %
29.68 32.07 47.82 50.12 45.77

Hefei Chipmore Technology Co Quarterly Data
Dec19 Dec20 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
EBITDA Margin % Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 14.19 29.30 31.99 28.66 21.17

Competitive Comparison of Hefei Chipmore Technology Co's EBITDA Margin %

For the Semiconductor Equipment & Materials subindustry, Hefei Chipmore Technology Co's EBITDA Margin %, along with its competitors' market caps and EBITDA Margin % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Hefei Chipmore Technology Co's EBITDA Margin % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Hefei Chipmore Technology Co's EBITDA Margin % distribution charts can be found below:

* The bar in red indicates where Hefei Chipmore Technology Co's EBITDA Margin % falls into.



Hefei Chipmore Technology Co EBITDA Margin % Calculation

EBITDA margin is the ratio of EBITDA divided by net sales or Revenue, usually presented in percent.

Hefei Chipmore Technology Co's EBITDA Margin % for the fiscal year that ended in Dec. 2023 is calculated as

EBITDA Margin %=EBITDA (A: Dec. 2023 )/Revenue (A: Dec. 2023 )
=745.687/1629.34
=45.77 %

Hefei Chipmore Technology Co's EBITDA Margin % for the quarter that ended in Mar. 2024 is calculated as

EBITDA Margin %=EBITDA (Q: Mar. 2024 )/Revenue (Q: Mar. 2024 )
=93.876/443.405
=21.17 %

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Hefei Chipmore Technology Co  (SHSE:688352) EBITDA Margin % Explanation

EBITDA Margin % is the ratio of EBITDA divided by net sales or Revenue. It is an performance metric measuring company's operating profitability. EBITDA Margin takes depreciation and amortization, interest expense and tax into account, which makes it easy to compare the relative profitability of companies of different sizes in the same industry.


Hefei Chipmore Technology Co EBITDA Margin % Related Terms

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Hefei Chipmore Technology Co (SHSE:688352) Business Description

Traded in Other Exchanges
N/A
Address
Comprehensive Free Trade Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230011
Hefei Chipmore Technology Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It can provide customers with a full range of comprehensive integrated circuit packaging and testing services, covering display driver chips, power management chips, RF front-end chips and other products.
Executives
Wang Xiao Feng Core technical personnel

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