ACM Research (FRA:813) Insider Ownership : 0.00 % (As of May. 21, 2024)

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What is ACM Research Insider Ownership?

Insider ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, ACM Research's insider ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, ACM Research's Institutional Ownership is 33.16%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, ACM Research's Float Percentage Of Total Shares Outstanding is 73.92%.

ACM Research Insider Ownership Historical Data

The historical data trend for ACM Research's Insider Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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ACM Research Insider Ownership Chart

ACM Research Annual Data

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Insider Ownership

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ACM Research Quarterly Data
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ACM Research Insider Ownership Calculation

The percentage of shares that are owned by company insiders relative to the total shares outstanding.

ACM Research (FRA:813) Business Description

Industry

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ACMR:USA

Address

42307 Osgood Road, Suite I, Fremont, CA, USA, 94539

Website

https://www.acmrcsh.com

ACM Research Inc is an us-based company. It is engaged in developing, manufacturing, and selling single-wafer wet cleaning equipment, which is used by semiconductor manufacturers in numerous manufacturing steps to remove particles, contaminants, and other random defects to improve product yield, in fabricating integrated circuits, or chips. The company offers space alternated phase shift which employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces on a microscopic level; and Timely Energized Bubble Oscillation technology which provides effective, damage-free cleaning for both conventional two and three-dimensional patterned wafers at process nodes.

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