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Taiwan Asia Semiconductor (TPE:2340) LT-Debt-to-Total-Asset : 0.22 (As of Mar. 2024)


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What is Taiwan Asia Semiconductor LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. Taiwan Asia Semiconductor's long-term debt to total assests ratio for the quarter that ended in Mar. 2024 was 0.22.

Taiwan Asia Semiconductor's long-term debt to total assets ratio increased from Mar. 2023 (0.06) to Mar. 2024 (0.22). It may suggest that Taiwan Asia Semiconductor is progressively becoming more dependent on debt to grow their business.


Taiwan Asia Semiconductor LT-Debt-to-Total-Asset Historical Data

The historical data trend for Taiwan Asia Semiconductor's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Taiwan Asia Semiconductor LT-Debt-to-Total-Asset Chart

Taiwan Asia Semiconductor Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.10 0.09 0.02 0.04 0.15

Taiwan Asia Semiconductor Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.06 0.08 0.10 0.15 0.22

Taiwan Asia Semiconductor LT-Debt-to-Total-Asset Calculation

Taiwan Asia Semiconductor's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2023 is calculated as

LT Debt to Total Assets (A: Dec. 2023 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2023 )/Total Assets (A: Dec. 2023 )
=1865.928/12491.929
=0.15

Taiwan Asia Semiconductor's Long-Term Debt to Total Asset Ratio for the quarter that ended in Mar. 2024 is calculated as

LT Debt to Total Assets (Q: Mar. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Mar. 2024 )/Total Assets (Q: Mar. 2024 )
=2978.436/13410.319
=0.22

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Taiwan Asia Semiconductor  (TPE:2340) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


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Taiwan Asia Semiconductor (TPE:2340) Business Description

Traded in Other Exchanges
N/A
Address
No. 1, Li-Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 30078
Taiwan Asia Semiconductor Corp is engaged in the manufacture and sales of semiconductor components as well as research and development, design, manufacture, and sales of systems products. Its products consist of visible light-emitting diode chips, photodiodes, phototransistors, photo-sensing controllable thyristors, Zener diode chips, resistor chips, infrared radiation chips, colored light, IR LED, vertical-cavity surface-emitting lasers, light-emitting diode displays, automotive lighting, among others. Its segment consists of LED and silicon vendor chips group, Displays and lighting group, and Packaging business group.

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