Cyient DLM (BOM:543933) Dividend Payout Ratio : 0.00 (As of Dec. 2024)

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What is Cyient DLM Dividend Payout Ratio?

The Dividend Payout Ratio is the measure of dividends paid out to shareholders relative to the company's net income. It is calculated as the Dividends per Share divided by the Earnings per Share (Diluted) during the same time period. Cyient DLM's Dividend Payout Ratio for the months ended in Dec. 2024 was 0.00.

The historical rank and industry rank for Cyient DLM's Dividend Payout Ratio or its related term are showing as below:

BOM:543933's Dividend Payout Ratio is not ranked ^*
in the Hardware industry.
Industry Median: 0.45
* Ranked among companies with meaningful Dividend Payout Ratio only.

As of today (2025-03-14), the Dividend Yield % of Cyient DLM is 0.00%.

Cyient DLM's Dividends per Share for the months ended in Dec. 2024 was ₹0.00.

The growth rate is calculated with least square regression.

For more information regarding to dividend, please check our Dividend Page.

* Please note that "special dividend" is not included in the calculation of dividend per share and related fields.

Cyient DLM Dividend Payout Ratio Historical Data

The historical data trend for Cyient DLM's Dividend Payout Ratio can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Cyient DLM Dividend Payout Ratio Chart

Cyient DLM Annual Data

Trend

Mar21

Mar22

Mar23

Mar24

Dividend Payout Ratio

Cyient DLM Quarterly Data
	Mar21	Mar22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Dividend Payout Ratio	Get a 7-Day Free Trial							-	-	-	-	-

Competitive Comparison of Cyient DLM's Dividend Payout Ratio

For the Electronic Components subindustry, Cyient DLM's Dividend Payout Ratio, along with its competitors' market caps and Dividend Payout Ratio data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Cyient DLM's Dividend Payout Ratio Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Cyient DLM's Dividend Payout Ratio distribution charts can be found below:

* The bar in red indicates where Cyient DLM's Dividend Payout Ratio falls into.

Cyient DLM Dividend Payout Ratio Calculation

Cyient DLM's Dividend Payout Ratio for the fiscal year that ended in Mar. 2024 is calculated as

Dividend Payout Ratio	=	Dividends per Share (A: Mar. 2024 )	/	EPS without NRI (A: Mar. 2024 )
	=	0	/	8.39
	=	0.00

Cyient DLM's Dividend Payout Ratio for the quarter that ended in Dec. 2024 is calculated as

Dividend Payout Ratio	=	Dividends per Share (Q: Dec. 2024 )	/	EPS without NRI (Q: Dec. 2024 )
	=	0	/	1.38
	=	0.00

Cyient DLM (BOM:543933) Dividend Payout Ratio Explanation

In dividends investing, Dividend Payout Ratio and Dividend Growth Rate are the two most important variables for consideration. A lower payout ratio may indicate that the company has more room to increase its dividends.

Cyient DLM Dividend Payout Ratio Related Terms

Thank you for viewing the detailed overview of Cyient DLM's Dividend Payout Ratio provided by GuruFocus.com. Please click on the following links to see related term pages.

Cyient DLM Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Hardware » Cyient DLM Ltd (BOM:543933) » Definitions » Dividend Payout Ratio

Comparable Companies

Traded in Other Exchanges

CYIENTDLM:India

Address

Plot no.347, D1 &2, KIADB, Electronics City, Hebbal Industrial Area, Mysuru, KA, IND, 570016

Website

https://www.cyientdlm.com

Cyient DLM Ltd is engaged in integrated Electronic Manufacturing Services (EMS) and solutions providers with capabilities across the value chain and the entire life cycle of a product, including design, build, and maintenance. Its solutions comprise the manufacture of the printed circuit board (PCB) assembly (PCBA), cable harnesses, and box builds which are used in safety-critical systems such as cockpits, inflight systems, landing systems, and medical diagnostic equipment, which the company provides to its clients as B2P or B2S services.

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