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ACM Research (FRA:813) Valuation Rank


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What is ACM Research Valuation Rank?

The Valuation Rank measures the current valuation of a business relative to other companies in the same industry and its own historical valuation. The companies are split in equal numbers and then ranked from 1 to 10, with 10 as the most undervalued and 1 as the most overvalued.

  1. Three factors:
    • Absolute valuation (medpsvalue) relative to current stock price, rank among all companies
    • Historical valuation over the past 10 years. Rank pe, ps, pocf, ev2ebit over their own historical values
    • Industry relative valuation
  2. Companies without enough data is not ranked
  3. Companies with negative earnings are ranked lower

These three factors are used to calculate the value score for every eligible company, with values from 1 to 10. The final ranked companies are split in equal numbers and ranked from 1 to 10, with 10 as the most undervalued, and 1 as the most overvalued. The numbers of companies in each rank are the same.

ACM Research Valuation Rank Related Terms

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ACM Research (FRA:813) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » ACM Research Inc (FRA:813) » Definitions » Valuation Rank
Comparable Companies
INDI ICHR AEHR UCTT PLAB VECO ATOM TGAN INTT ASYS XAMS:ASML AMAT LRCX KLAC TSE:8035 SHSE:601012 XAMS:ASM TSE:6146 TSE:6857 SZSE:002371
Traded in Other Exchanges
ACMR:USA
Address
42307 Osgood Road, Suite I, Fremont, CA, USA, 94539
Website
https://www.acmrcsh.com
ACM Research Inc is an us-based company. It is engaged in developing, manufacturing, and selling single-wafer wet cleaning equipment, which is used by semiconductor manufacturers in numerous manufacturing steps to remove particles, contaminants, and other random defects to improve product yield, in fabricating integrated circuits, or chips. The company offers space alternated phase shift which employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces on a microscopic level; and Timely Energized Bubble Oscillation technology which provides effective, damage-free cleaning for both conventional two and three-dimensional patterned wafers at process nodes.