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Powertech Technology (TPE:6239) ROE % Adjusted to Book Value : 6.74% (As of Sep. 2024)


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What is Powertech Technology ROE % Adjusted to Book Value?

Powertech Technology's ROE % for the quarter that ended in Sep. 2024 was 12.54%. Powertech Technology's PB Ratio for the quarter that ended in Sep. 2024 was 1.86. Powertech Technology's ROE % Adjusted to Book Value for the quarter that ended in Sep. 2024 was 6.74%.


Powertech Technology ROE % Adjusted to Book Value Historical Data

The historical data trend for Powertech Technology's ROE % Adjusted to Book Value can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Powertech Technology ROE % Adjusted to Book Value Chart

Powertech Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
ROE % Adjusted to Book Value
Get a 7-Day Free Trial Premium Member Only Premium Member Only 7.72 9.36 12.43 15.11 7.79

Powertech Technology Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
ROE % Adjusted to Book Value Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 8.47 15.59 4.71 5.05 6.74

Competitive Comparison of Powertech Technology's ROE % Adjusted to Book Value

For the Semiconductor Equipment & Materials subindustry, Powertech Technology's ROE % Adjusted to Book Value, along with its competitors' market caps and ROE % Adjusted to Book Value data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Powertech Technology's ROE % Adjusted to Book Value Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Powertech Technology's ROE % Adjusted to Book Value distribution charts can be found below:

* The bar in red indicates where Powertech Technology's ROE % Adjusted to Book Value falls into.



Powertech Technology ROE % Adjusted to Book Value Calculation

Powertech Technology's ROE % Adjusted to Book Value for the fiscal year that ended in Dec. 2023 is calculated as

ROE % Adjusted to Book Value=ROE % / PB Ratio
=14.95% / 1.92
=7.79%

Powertech Technology's ROE % Adjusted to Book Value for the quarter that ended in Sep. 2024 is calculated as

ROE % Adjusted to Book Value=ROE % / PB Ratio
=12.54% / 1.86
=6.74%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Powertech Technology ROE % Adjusted to Book Value Related Terms

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Powertech Technology Business Description

Traded in Other Exchanges
N/A
Address
No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, TWN, 30352
Powertech Technology Inc is mainly engaged in the manufacturing, packaging, testing, researching and developing, designing, assembling, and selling of various integrated circuit products. PTI also provides semiconductor testing and assembly services on a turnkey basis, in which PTI buys fabricated wafers and sells tested and assembled semiconductors. Geographically, the majority of revenue is derived from Japan & Taiwan. The company serves international customers with services including chip bumping, chip probing, IC assembly, final testing, burn-in, and system-level assembly.

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