MI Technovation Bhd (XKLS:5286) Total Current Assets : RM674.6 Mil (As of Dec. 2024)

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What is MI Technovation Bhd Total Current Assets?

Total current assets includes Cash, Cash Equivalents, Marketable Securities, Total Receivables, Total Inventories, and Other Current Assets. MI Technovation Bhd's total current assets for the quarter that ended in Dec. 2024 was RM674.6 Mil.

MI Technovation Bhd Total Current Assets Historical Data

The historical data trend for MI Technovation Bhd's Total Current Assets can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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MI Technovation Bhd Total Current Assets Chart

MI Technovation Bhd Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Total Current Assets

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283.53

677.50

715.45

700.89

674.64

MI Technovation Bhd Quarterly Data
	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24
Total Current Assets	Get a 7-Day Free Trial															700.89	715.10	732.60	646.27	674.64

MI Technovation Bhd Total Current Assets Calculation

Total Current Assets are the asset that can be converted to cash or used to pay current liabilities within 12 months.

MI Technovation Bhd's Total Current Assets for the fiscal year that ended in Dec. 2024 is calculated as

Total Current Assets	=	Cash, Cash Equivalents, Marketable Securities	+	Total Receivables	+	Total Inventories	+	Other Current Assets
	=	344.749	+	160.091	+	157.42	+	12.381
	=	674.6

MI Technovation Bhd's Total Current Assets for the quarter that ended in Dec. 2024 is calculated as

Total Current Assets	=	Cash, Cash Equivalents, Marketable Securities	+	Total Receivables	+	Total Inventories	+	Other Current Assets
	=	344.749	+	160.091	+	157.42	+	12.381
	=	674.6

Total Current Assets is linked to the Current Ratio, which is the result of dividing total current assets by total current liabilities. It is frequently used as an indicator of a company's liquidity, its ability to meet short-term obligations.

Total Current Assets is also linked to Working Capital, Net working capital is calculated as Total Current Assets minus Total Current Liabilities.

MI Technovation Bhd (XKLS:5286) Total Current Assets Explanation

In Ben Graham's calculation of liquidation value, inventory is only considered worth half of its book value, and accounts receivable is considered worth 75% of its value. Therefore the liquidation value is lower than calculated from total current assets.

MI Technovation Bhd's Liquidation Value for the quarter that ended in Dec. 2024 is

	Liquidation value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	344.749	-	150.121	+	0.75 * 152.358	+	0.5 * 157.42
=	387.6

MI Technovation Bhd Total Current Assets Related Terms

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MI Technovation Bhd Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » MI Technovation Bhd (XKLS:5286) » Definitions » Total Current Assets

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Traded in Other Exchanges

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Address

No. 20, Medan Bayan Lepas Technoplex, MK 12, Taman Perindustrian Bayan Lepas, Bayan Lepas, PNG, MYS, 11900

Website

https://www.mi-eq.com

MI Technovation Bhd is an investment holding company. The group is involved in the design, development, manufacture, and sale of wafer-level chip-scale packaging sorting machines with inspection and testing capabilities for the semiconductor industry. Its reportable segments include Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, Semiconductor Solutions Business Unit, and Others. Its majority of revenue comes from the Semiconductor Material Business Unit segment which is Involved in the manufacturing and sale of solder spheres (also known as solder balls), a key assembly and packaging material in the semiconductor industry.

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