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ASE Technology Holding Co (ASE Technology Holding Co) Total Liabilities : $11,653 Mil (As of Mar. 2024)


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What is ASE Technology Holding Co Total Liabilities?

ASE Technology Holding Co's Total Liabilities for the quarter that ended in Mar. 2024 was $11,653 Mil.

ASE Technology Holding Co's quarterly Total Liabilities declined from Sep. 2023 ($12,028.90 Mil) to Dec. 2023 ($11,268.74 Mil) but then increased from Dec. 2023 ($11,268.74 Mil) to Mar. 2024 ($11,652.67 Mil).

ASE Technology Holding Co's annual Total Liabilities declined from Dec. 2021 ($14,599.01 Mil) to Dec. 2022 ($12,864.03 Mil) and declined from Dec. 2022 ($12,864.03 Mil) to Dec. 2023 ($11,268.74 Mil).


ASE Technology Holding Co Total Liabilities Historical Data

The historical data trend for ASE Technology Holding Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

ASE Technology Holding Co Total Liabilities Chart

ASE Technology Holding Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 11,382.45 12,495.72 14,599.01 12,864.03 11,268.74

ASE Technology Holding Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 12,631.78 12,162.71 12,028.90 11,268.74 11,652.67

ASE Technology Holding Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

ASE Technology Holding Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=7221.222+(3488.269+184.221
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+243.125+131.903)
=11,269

Total Liabilities=Total Assets (A: Dec. 2023 )-Total Equity (A: Dec. 2023 )
=21340.278-10071.538
=11,269

ASE Technology Holding Co's Total Liabilities for the quarter that ended in Mar. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=7227.064+(3666.715+758.889
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+0+0)
=11,653

Total Liabilities=Total Assets (Q: Mar. 2024 )-Total Equity (Q: Mar. 2024 )
=21502.632-9849.964
=11,653

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


ASE Technology Holding Co Total Liabilities Related Terms

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ASE Technology Holding Co (ASE Technology Holding Co) Business Description

Traded in Other Exchanges
Address
No. 26, Chin Third Road, Nanzih District, Kaohsiung, TWN, 811
ASE Technology Holding Co Ltd is a semiconductor assembly and testing firm. The company operates in segments: Packaging, Testing, and Electronic Manufacturing Services. Of these, packaging services contribute the most revenue. It involves packaging bare semiconductors into completed semiconductors with improved electrical and thermal characteristics. The Testing Segment includes front-end engineering testing, wafer probing, and final testing services. In the EMS segment, the company designs manufacture, and sells electronic components and telecommunication equipment motherboards. The company is based in Taiwan but garners over half its sales from firms in the United States.