Shanghai Fudan Microelectronics Group Co (HKSE:01385) Total Liabilities : HK$2,565 Mil (As of Mar. 2024)

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What is Shanghai Fudan Microelectronics Group Co Total Liabilities?

Shanghai Fudan Microelectronics Group Co's Total Liabilities for the quarter that ended in Mar. 2024 was HK$2,565 Mil.

Shanghai Fudan Microelectronics Group Co's quarterly Total Liabilities increased from Sep. 2023 (HK$2,506.06 Mil) to Dec. 2023 (HK$2,679.37 Mil) but then declined from Dec. 2023 (HK$2,679.37 Mil) to Mar. 2024 (HK$2,564.70 Mil).

Shanghai Fudan Microelectronics Group Co's annual Total Liabilities increased from Dec. 2021 (HK$977.26 Mil) to Dec. 2022 (HK$1,069.50 Mil) and increased from Dec. 2022 (HK$1,069.50 Mil) to Dec. 2023 (HK$2,679.37 Mil).

Shanghai Fudan Microelectronics Group Co Total Liabilities Historical Data

The historical data trend for Shanghai Fudan Microelectronics Group Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Shanghai Fudan Microelectronics Group Co Total Liabilities Chart

Shanghai Fudan Microelectronics Group Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Total Liabilities

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578.73

671.61

977.26

1,069.50

2,679.37

Shanghai Fudan Microelectronics Group Co Quarterly Data
	Jun17	Dec17	Jun18	Dec18	Jun19	Dec19	Jun20	Dec20	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Total Liabilities	Get a 7-Day Free Trial															1,796.00	2,488.57	2,506.06	2,679.37	2,564.70

Shanghai Fudan Microelectronics Group Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Shanghai Fudan Microelectronics Group Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	2055.562	+	(603.519	+	20.293
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	0)
	=	2,679

Total Liabilities	=	Total Assets (A: Dec. 2023 )	-	Total Equity (A: Dec. 2023 )
	=	9200.158	-	6520.784
	=	2,679

Shanghai Fudan Microelectronics Group Co's Total Liabilities for the quarter that ended in Mar. 2024 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	2015.691	+	(522.285	+	26.726
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	0)
	=	2,565

Total Liabilities	=	Total Assets (Q: Mar. 2024 )	-	Total Equity (Q: Mar. 2024 )
	=	9229.146	-	6664.443
	=	2,565

Shanghai Fudan Microelectronics Group Co Total Liabilities Related Terms

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Shanghai Fudan Microelectronics Group Co (HKSE:01385) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Shanghai Fudan Microelectronics Group Co Ltd (HKSE:01385) » Definitions » Total Liabilities

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Traded in Other Exchanges

SFDMY:USA FUD:Germany 688385:China

Address

98 Granville Road, Flat 6, 5th Floor, East Ocean Centre, Tsimshatsui East, Kowloon, Hong Kong, HKG

Website

http://www.fmsh.com

Shanghai Fudan Microelectronics Group Company Limited is principally engaged in the integrated circuit (IC) related businesses. The Company operates through two business segments: the design, development and sales of IC products segment and the provision of testing services for IC products segment. The Company is also engaged in the production of probe cards, the development and sales of hardware and software of computers, electronic products and communication equipment and the provision of investment management and consultancy services, research and consultancy services of IC technology and research and consultancy services of computer and network technology through its subsidiaries.

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