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JCET Group Co (SHSE:600584) Short Percentage of Float


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What is JCET Group Co Short Percentage of Float?

Short Percentage of Float is the percentage of shares shorted compared to the float.

Due to the license agreement change with our data vendor, Short Interest related data is no longer available on GuruFocus website.

Competitive Comparison of JCET Group Co's Short Percentage of Float

For the Semiconductors subindustry, JCET Group Co's Short Percentage of Float, along with its competitors' market caps and Short Percentage of Float data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

JCET Group Co's Short Percentage of Float Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, JCET Group Co's Short Percentage of Float distribution charts can be found below:

* The bar in red indicates where JCET Group Co's Short Percentage of Float falls into.


JCET Group Co (SHSE:600584) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » JCET Group Co Ltd (SHSE:600584) » Definitions » Short Percentage of Float
Comparable Companies
SHSE:688188 SHSE:688396 SZSE:300782 SZSE:002049 SHSE:603986 SZSE:300661 SHSE:688047 SHSE:688008 SHSE:688469 SHSE:600460 NVDA AVGO TPE:2330 AMD QCOM TXN INTC MU ADI XKRX:000660
Traded in Other Exchanges
N/A
Address
No. 99, Chengjiang East Road, Jiangsu Province, Jiangyin, CHN, 214431
Website
http://www.cj-elec.com
JCET Group Co Ltd is engaged in providing packaging design, product development, and certification, with a range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment. The company has a portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA) and System-in-Package (SiP).

JCET Group Co (SHSE:600584) Headlines

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