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JCET Group Co (SHSE:600584) Valuation Rank


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What is JCET Group Co Valuation Rank?

The Valuation Rank measures the current valuation of a business relative to other companies in the same industry and its own historical valuation. The companies are split in equal numbers and then ranked from 1 to 10, with 10 as the most undervalued and 1 as the most overvalued.

  1. Three factors:
    • Absolute valuation (medpsvalue) relative to current stock price, rank among all companies
    • Historical valuation over the past 10 years. Rank pe, ps, pocf, ev2ebit over their own historical values
    • Industry relative valuation
  2. Companies without enough data is not ranked
  3. Companies with negative earnings are ranked lower

These three factors are used to calculate the value score for every eligible company, with values from 1 to 10. The final ranked companies are split in equal numbers and ranked from 1 to 10, with 10 as the most undervalued, and 1 as the most overvalued. The numbers of companies in each rank are the same.

JCET Group Co Valuation Rank Related Terms

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JCET Group Co (SHSE:600584) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » JCET Group Co Ltd (SHSE:600584) » Definitions » Valuation Rank
Comparable Companies
SHSE:688188 SHSE:688396 SZSE:300782 SZSE:002049 SHSE:603986 SZSE:300661 SHSE:688047 SHSE:688008 SHSE:688469 SHSE:600460 NVDA AVGO TPE:2330 AMD QCOM TXN INTC MU ADI XKRX:000660
Traded in Other Exchanges
N/A
Address
No. 99, Chengjiang East Road, Jiangsu Province, Jiangyin, CHN, 214431
Website
http://www.cj-elec.com
JCET Group Co Ltd is engaged in providing packaging design, product development, and certification, with a range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment. The company has a portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA) and System-in-Package (SiP).