Integrated Memory Logic (TPE:3638) Change In Payables And Accrued Expense : NT$0 Mil (TTM As of Jun. 2014)

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What is Integrated Memory Logic Change In Payables And Accrued Expense?

Integrated Memory Logic's Change In Payables And Accrued Expense for the quarter that ended in Jun. 2014 was NT$0 Mil. It means Integrated Memory Logic's Accounts Payable & Accrued Expense stayed the same from Mar. 2014 to Jun. 2014 .

Integrated Memory Logic's Change In Payables And Accrued Expense for the fiscal year that ended in Dec. 2013 was NT$0 Mil. It means Integrated Memory Logic's Accounts Payable & Accrued Expense stayed the same from Dec. 2012 to Dec. 2013 .

Integrated Memory Logic Change In Payables And Accrued Expense Historical Data

The historical data trend for Integrated Memory Logic's Change In Payables And Accrued Expense can be seen below:

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Integrated Memory Logic Change In Payables And Accrued Expense Chart

Integrated Memory Logic Annual Data

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Change In Payables And Accrued Expense

Integrated Memory Logic Quarterly Data
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Integrated Memory Logic Change In Payables And Accrued Expense Calculation

Change In Payables And Accrued Expense is the increase or decrease between periods of the Accounts Payable & Accrued Expense. Accrued expenses represent expenses incurred at the end of the reporting period but not yet paid; also called accrued liabilities. The accrued liability is shown under Liabilities section in the balance sheet.

Change In Payables And Accrued Expense for the trailing twelve months (TTM) ended in Jun. 2014 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$0 Mil.

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Integrated Memory Logic (TPE:3638) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Integrated Memory Logic Ltd. (TPE:3638) » Definitions » Change In Payables And Accrued Expense

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Address

Website

http://www.iml-inc.com.tw

Integrated Memory Logic Ltd. provides analog, power management, and mixed signal IC solutions for LCD panel applications. It also designs custom chips; and provides packaging and testing outsourcing services.

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