Taiwan IC Packaging (ROCO:3372) Current Deferred Revenue : NT$0.0 Mil (As of Mar. 2024)

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What is Taiwan IC Packaging Current Deferred Revenue?

Current Deferred Revenue represents collections of cash or other assets related to revenue producing activity for which revenue has not yet been recognized. Generally, an entity records deferred revenue when it receives consideration from a customer before achieving certain criteria that must be met for revenue to be recognized in conformity with GAAP. It can be either current or non-current item. Also called unearned revenue.

Taiwan IC Packaging's current deferred revenue for the quarter that ended in Mar. 2024 was NT$0.0 Mil.

Taiwan IC Packaging Current Deferred Revenue Historical Data

The historical data trend for Taiwan IC Packaging's Current Deferred Revenue can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Taiwan IC Packaging Current Deferred Revenue Chart

Taiwan IC Packaging Annual Data

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Current Deferred Revenue

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Taiwan IC Packaging Quarterly Data
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Taiwan IC Packaging (ROCO:3372) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Taiwan IC Packaging Corp (ROCO:3372) » Definitions » Current Deferred Revenue

Comparable Companies

Traded in Other Exchanges

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Address

No. 1, South 2rd Road, Qianzhen District, Kaohsiung City, TWN

Website

https://www.ticp.com.tw

Taiwan IC Packaging Corp is a professional integrated circuit packaging provider. The company provides integrated circuit packaging and testing services for the professional semiconductor. The company offers packages in two groups Lead frame-based package and substrate-based package. Leadframe-based package includes quad flat package (QFP), small outline package (SOP), thin small outline package (TSOP), quad flat no- Lead (QFN) and dual flat no Lead (DFN). LGA/Memory Card and other product.

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