Focused on building reliable datasets, financial models, and research tools for value-minded investors. Committed to turning complex data into practical guidance for value-investing and long-term wealth.
Dr. Charlie Tian is the founder and CEO of GuruFocus.com, a leading global investment research platform established in 2004. With a Ph.D. in physics, Dr. Tian transitioned from science to finance, applying a data-driven, disciplined approach to value investing.
Taiwan IC PackagingROCO:3372 -0.33%63 Debt-to-EBITDA is 0.60 as of Jun. 2026, which is 300% above its 10-year median of 0.15. GuruFocus rates ROCO:3372 with a GF Score™ of 63/100 and a GF Value™ of NT$20.31 (Modestly Undervalued). The stock has 2 warning signs investors should review. Among 747 Semiconductors companies, Taiwan IC Packaging ranks better than 58.1% on this metric.
Debt-to-EBITDA measures a company's ability to pay off its debt.
A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.
The historical rank and industry rank for Taiwan IC Packaging's Debt-to-EBITDA or its related term are showing as below:
ROCO:3372'
s Debt-to-EBITDA Range Over the Past 10 Years
Min: -17.01 Med: 0.15 Max: 1.79
Current: 0.91
During the past 13 years, the highest Debt-to-EBITDA Ratio of Taiwan IC Packaging was 1.79. The lowest was -17.01. And the median was 0.15.
ROCO:3372's Debt-to-EBITDA is ranked better than 58.1% of 747
companies
in the Semiconductors industry
Industry Median: 1.34
vs ROCO:3372: 0.91
A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.
According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.
Taiwan IC Packaging Debt-to-EBITDA Related Terms
Taiwan IC Packaging Debt-to-EBITDA Historical Data
* Premium members only.
The historical data trend for Taiwan IC Packaging's Debt-to-EBITDA can be seen below:
* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD. * For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.
ROCO:3372 vs NVDA, AVGO, MU: Debt-to-EBITDA Comparison
For the Semiconductors subindustry, Taiwan IC Packaging's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:
* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.
Taiwan IC Packaging Debt-to-EBITDA vs Semiconductors Industry
For the Semiconductors industry and Technology sector, Taiwan IC Packaging's Debt-to-EBITDA distribution charts can be found below:
* The bar in red indicates where Taiwan IC Packaging's Debt-to-EBITDA falls into.
* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD. * For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.
In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data,
the EBITDA data used here is four times the quarterly (Jun. 2026) EBITDA data.
Taiwan IC Packaging (ROCO:3372) has a Debt-to-EBITDA of 0.60 as of Jun. 2026. Debt-to-EBITDA ratio represents the ratio of total debt to total earnings before interest, taxes, depreciation and amortization. View historical data on Taiwan IC Packaging. This is 300% above median its historical median of 0.15. According to the industry distribution chart, Taiwan IC Packaging ranks #313 out of 747 companies in the Semiconductors industry, placing it in the top 41.9%.
Is Taiwan IC Packaging's Debt-to-EBITDA too high?
Taiwan IC Packaging's current Debt-to-EBITDA of 0.60 is 300% above median its 10-year median of 0.15. The Semiconductors industry median Debt-to-EBITDA is 1.34. Taiwan IC Packaging's value of 0.60 is 55.2% below this industry median. Based on the distribution chart, Taiwan IC Packaging ranks #313 out of 747 companies in the Semiconductors industry, which is above the industry midpoint. Overall, Taiwan IC Packaging has a GF Score™ of 63/100 and is considered Modestly Undervalued, reflecting its overall financial health beyond just this single metric.
How does Taiwan IC Packaging's Debt-to-EBITDA compare to NVDA and AVGO?
According to the Semiconductors industry distribution chart, Taiwan IC Packaging ranks #313 out of 747 companies for Debt-to-EBITDA. This puts Taiwan IC Packaging in the upper half of its industry. The industry median Debt-to-EBITDA is 1.34. Taiwan IC Packaging's value of 0.60 is 55.2% below this benchmark. While the company's 10-year median is 0.15 vs. the industry median of 1.34, Taiwan IC Packaging has consistently been below the industry average. See the competitive comparison table and distribution chart on this page for a detailed peer-by-peer breakdown.
What is a good Debt-to-EBITDA for a Semiconductors company?
The median Debt-to-EBITDA among Semiconductors companies is 1.34, based on 747 companies in the industry. Companies in the top quartile (top 25%) have a Debt-to-EBITDA significantly above this median, while those in the bottom quartile fall well below. However, Debt-to-EBITDA should not be evaluated in isolation — investors should consider it alongside profitability, growth, and financial strength metrics. Taiwan IC Packaging's current Debt-to-EBITDA of 0.60 is 55.2% below the industry median. Use the industry distribution chart on this page to see where any company falls relative to its peers.
What does a high Debt-to-EBITDA mean?
A high Debt-to-EBITDA can signal that a stock is expensive relative to its fundamentals. Debt-to-EBITDA ratio represents the ratio of total debt to total earnings before interest, taxes, depreciation and amortization. View historical data on Taiwan IC Packaging. For the Semiconductors industry, the median Debt-to-EBITDA is 1.34 — values significantly above this may indicate overvaluation, while values below may suggest a bargain or underlying issues. Taiwan IC Packaging's current Debt-to-EBITDA is 0.60, which is 300% above median its own 10-year median of 0.15. However, context matters — high-growth companies often justify higher valuations. Always evaluate alongside other metrics like GF Score™ and GF Value™.
Is Taiwan IC Packaging stock overvalued right now?
Based on GuruFocus' analysis, Taiwan IC Packaging (ROCO:3372) is currently considered Modestly Undervalued. The stock's GF Value™ is NT$20.31, compared to a current price of NT$14.95 — trading 26.4% below its estimated fair value. The current Debt-to-EBITDA is 0.60, which is 300% above median its 10-year median of 0.15 and 55.2% below the Semiconductors industry median of 1.34. Taiwan IC Packaging's overall GF Score™ is 63/100 with 2 warning signs to review. Investors should evaluate multiple metrics — including profitability, growth, and financial strength — before making a decision.
How is Debt-to-EBITDA calculated?
Debt-to-EBITDA is calculated from a company's financial statements. For Taiwan IC Packaging (ROCO:3372), the current Debt-to-EBITDA is 0.60 as of Jun. 2026. GuruFocus calculates this using data sourced from SEC filings and annual reports. See the calculation section and 30-year financial data on this page for the full breakdown.
Is Taiwan IC Packaging (ROCO:3372) Overvalued in 2026?
Based on GuruFocus' analysis, Taiwan IC Packaging stock appears to be undervalued.
The current stock price of NT$14.95 is trading 26.4% below its estimated GF Value™ of NT$20.31.
GuruFocus considers Taiwan IC Packaging to be Modestly Undervalued.
Key valuation signals for ROCO:3372:
Debt-to-EBITDA: 0.60 (300% above median its 10-year median of 0.15)
GF Value™: NT$20.31 vs. price of NT$14.95 (26.4% below fair value)
Industry Position: 55.2% below the Semiconductors median (#313 of 747)
No single metric tells the full story. See the ROCO:3372 stock analysis page for a complete view including 30-year financials, guru trades, and insider activity.
Taiwan IC Packaging Corp is engaged in semiconductor packaging and testing. It has one operating segment: Semiconductor packaging and testing. Majority of revenue is generated from Semiconductor Packaging and testing. The company opertes in Taiwan, Korea, America, and Other International Countries, with the majority of revenue from Taiwan.
63GF Score
Get the complete analysis for ROCO:3372
Debt-to-EBITDA is just one metric. See GF Value™, 30-year financials, guru trades, warning signs, and more.
Quick Browse
Personalize
Premium Gurus 
Create New Portfolio
ROCO:3372 has been successfully added to your 
