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Axcelis Technologies (MEX:ACLS) Issuance of Debt : MXN0 Mil (TTM As of Dec. 2024)


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What is Axcelis Technologies Issuance of Debt?

Axcelis Technologies's Issuance of Debt for the three months ended in Dec. 2024 was MXN0 Mil.

Axcelis Technologies's Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 was MXN0 Mil.


Axcelis Technologies Issuance of Debt Historical Data

The historical data trend for Axcelis Technologies's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Axcelis Technologies Issuance of Debt Chart

Axcelis Technologies Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Issuance of Debt
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Axcelis Technologies Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
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Axcelis Technologies Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Dec. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was MXN0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Axcelis Technologies Issuance of Debt Related Terms

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Axcelis Technologies Business Description

Traded in Other Exchanges
Address
108 Cherry Hill Drive, Beverly, MA, USA, 01915
Axcelis Technologies Inc designs, manufactures, and services ion implantation and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, the company provides aftermarket lifecycle products and services, including used tools, spare parts, equipment upgrades, maintenance services, and customer training. Geographically, the group has a business presence in North America, Asia Pacific, and Europe, of which key revenue is derived from the Asia Pacific.