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Axcelis Technologies (MEX:ACLS) Debt-to-Asset : 0.03 (As of Dec. 2024)


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What is Axcelis Technologies Debt-to-Asset?

Axcelis Technologies's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2024 was MXN28 Mil. Axcelis Technologies's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2024 was MXN883 Mil. Axcelis Technologies's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Dec. 2024 was MXN28,130 Mil. Axcelis Technologies's debt to asset for the quarter that ended in Dec. 2024 was 0.03.


Axcelis Technologies Debt-to-Asset Historical Data

The historical data trend for Axcelis Technologies's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Axcelis Technologies Debt-to-Asset Chart

Axcelis Technologies Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.08 0.06 0.05 0.04 0.03

Axcelis Technologies Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.04 0.03 0.04 0.03 0.03

Competitive Comparison of Axcelis Technologies's Debt-to-Asset

For the Semiconductor Equipment & Materials subindustry, Axcelis Technologies's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Axcelis Technologies's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Axcelis Technologies's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Axcelis Technologies's Debt-to-Asset falls into.


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Axcelis Technologies Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Axcelis Technologies's Debt-to-Asset for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(28.051 + 882.801) / 28129.772
=0.03

Axcelis Technologies's Debt-to-Asset for the quarter that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(28.051 + 882.801) / 28129.772
=0.03

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Axcelis Technologies  (MEX:ACLS) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Axcelis Technologies Debt-to-Asset Related Terms

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Axcelis Technologies Business Description

Traded in Other Exchanges
Address
108 Cherry Hill Drive, Beverly, MA, USA, 01915
Axcelis Technologies Inc designs, manufactures, and services ion implantation and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, the company provides aftermarket lifecycle products and services, including used tools, spare parts, equipment upgrades, maintenance services, and customer training. Geographically, the group has a business presence in North America, Asia Pacific, and Europe, of which key revenue is derived from the Asia Pacific.