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Advance Materials (ROCO:3585) Payments of Debt : NT$0.0 Mil (TTM As of Dec. 2024)


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What is Advance Materials Payments of Debt?

Advance Materials's Payments of Debt for the six months ended in Dec. 2024 was NT$0.0 Mil.

Advance Materials's Payments of Debt for the trailing twelve months (TTM) ended in Dec. 2024 was NT$0.0 Mil.


Advance Materials Payments of Debt Historical Data

The historical data trend for Advance Materials's Payments of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Advance Materials Payments of Debt Chart

Advance Materials Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Payments of Debt
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Advance Materials Semi-Annual Data
Jun15 Dec15 Jun16 Dec16 Jun17 Dec17 Jun18 Dec18 Jun19 Dec19 Jun20 Dec20 Jun21 Dec21 Jun22 Dec22 Jun23 Dec23 Jun24 Dec24
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Advance Materials Payments of Debt Calculation

Payments of Debt represents all the cash outflow from debt, including both long-term debt and short-term debt.

Payments of Debt for the trailing twelve months (TTM) ended in Dec. 2024 adds up the semi-annually data reported by the company within the most recent 12 months, which was NT$0.0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Advance Materials Payments of Debt Related Terms

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Advance Materials Business Description

Traded in Other Exchanges
N/A
Address
No.2 of 498 Lane, Luzhu Village, Taoyuan County, TWN
Advance Materials Corp is a professional supplier of electronic materials in Taiwan. Its products include Copper Clad Laminate, Liquid photo-imageable solder masks, Special Photoresist, FPC Materials related products, and Touch Panel Related Materials.

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