Union Semiconductor (Hefei) Co (SHSE:688403) Payments of Debt : ¥-582 Mil (TTM As of Mar. 2025)

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What is Union Semiconductor (Hefei) Co Payments of Debt?

Union Semiconductor (Hefei) Co's Payments of Debt for the three months ended in Mar. 2025 was ¥0 Mil.

Union Semiconductor (Hefei) Co's Payments of Debt for the trailing twelve months (TTM) ended in Mar. 2025 was ¥-582 Mil.

Union Semiconductor (Hefei) Co Payments of Debt Historical Data

The historical data trend for Union Semiconductor (Hefei) Co's Payments of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Union Semiconductor (Hefei) Co Payments of Debt Chart

Union Semiconductor (Hefei) Co Annual Data

Trend

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Payments of Debt

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-377.22

-469.20

-827.64

-581.57

Union Semiconductor (Hefei) Co Quarterly Data
	Dec18	Dec19	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24	Mar25
Payments of Debt	Get a 7-Day Free Trial															-	-18.30	-532.69	-30.59	-

Union Semiconductor (Hefei) Co Payments of Debt Calculation

Payments of Debt represents all the cash outflow from debt, including both long-term debt and short-term debt.

Payments of Debt for the trailing twelve months (TTM) ended in Mar. 2025 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥-582 Mil.

Union Semiconductor (Hefei) Co Payments of Debt Related Terms

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Union Semiconductor (Hefei) Co Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Union Semiconductor (Hefei) Co Ltd (SHSE:688403) » Definitions » Payments of Debt

Comparable Companies

Traded in Other Exchanges

N/A

Address

Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230012

Website

http://www.unionsemicon.com.cn

Union Semiconductor (Hefei) Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It focuses on the field of display driver chips. The company's main business is the front-end gold bumping manufacturing as the core and integrates wafer testing, back-end chip-on-glass, and chip-on-film links to form a full range of display driver chips.

Executives

Chen Han Zong	Core technical personnel
Xu Yuan Cheng	Core technical personnel

Union Semiconductor (Hefei) Co Headlines

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