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Union Semiconductor (Hefei) Co (SHSE:688403) ROCE % : 5.66% (As of Dec. 2024)


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What is Union Semiconductor (Hefei) Co ROCE %?

ROCE % measures how well a company generates profits from its capital. It is calculated as EBIT divided by Capital Employed, where Capital Employed is calculated as Total Assets minus Total Current Liabilities. Union Semiconductor (Hefei) Co's annualized ROCE % for the quarter that ended in Dec. 2024 was 5.66%.


Union Semiconductor (Hefei) Co ROCE % Historical Data

The historical data trend for Union Semiconductor (Hefei) Co's ROCE % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Union Semiconductor (Hefei) Co ROCE % Chart

Union Semiconductor (Hefei) Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
ROCE %
Get a 7-Day Free Trial 3.70 9.27 7.97 6.24 4.60

Union Semiconductor (Hefei) Co Quarterly Data
Dec18 Dec19 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
ROCE % Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 6.68 3.56 4.54 5.23 5.66

Union Semiconductor (Hefei) Co ROCE % Calculation

Union Semiconductor (Hefei) Co's annualized ROCE % for the fiscal year that ended in Dec. 2024 is calculated as:

ROCE %=EBIT/( (Capital Employed+Capital Employed)/ count )
(A: Dec. 2024 )  (A: Dec. 2023 )(A: Dec. 2024 )
=EBIT/( ( (Total Assets - Total Current Liabilities)+(Total Assets - Total Current Liabilities) )/ count )
(A: Dec. 2024 )  (A: Dec. 2023 )(A: Dec. 2024 )
=176.022/( ( (3596.297 - 364.886) + (4591.224 - 162.425) )/ 2 )
=176.022/( (3231.411+4428.799)/ 2 )
=176.022/3830.105
=4.60 %

Union Semiconductor (Hefei) Co's ROCE % of for the quarter that ended in Dec. 2024 is calculated as:

ROCE %=EBIT (1)/( (Capital Employed+Capital Employed)/ count )
(Q: Dec. 2024 )  (Q: Sep. 2024 )(Q: Dec. 2024 )
=EBIT/( ( (Total Assets - Total Current Liabilities)+(Total Assets - Total Current Liabilities) )/ count )
(Q: Dec. 2024 )  (Q: Sep. 2024 )(Q: Dec. 2024 )
=248.032/( ( (4547.538 - 213.516) + (4591.224 - 162.425) )/ 2 )
=248.032/( ( 4334.022 + 4428.799 )/ 2 )
=248.032/4381.4105
=5.66 %

(1) Note: The EBIT data used here is four times the quarterly (Dec. 2024) EBIT data.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Union Semiconductor (Hefei) Co  (SHSE:688403) ROCE % Explanation

ROCE % can be especially useful when comparing the performance of capital-intensive companies. Unlike ROE %, which indicates the profitability of Shareholders Equity, ROCE % also considers long-term debt in Capital Employed. This can be helpful when analyzing companies with significant debt, as the result is neutralized by taking debt into consideration.

Generally speaking, a higher ROCE % indicates a stonger profitability for a company. Moreover, it is important to look at the ratio from a long term perspective. Investors tend to favor companies with stable and rising ROCE % trend over those with volatile ones.


Union Semiconductor (Hefei) Co ROCE % Related Terms

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Union Semiconductor (Hefei) Co Business Description

Traded in Other Exchanges
N/A
Address
Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230012
Union Semiconductor (Hefei) Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It focuses on the field of display driver chips. The company's main business is the front-end gold bumping manufacturing as the core and integrates wafer testing, back-end chip-on-glass, and chip-on-film links to form a full range of display driver chips.
Executives
Chen Han Zong Core technical personnel
Xu Yuan Cheng Core technical personnel

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