Shenzhen Ampron Technology Co (SZSE:301413) Debt-to-Equity : 0.57 (As of Mar. 2024)

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What is Shenzhen Ampron Technology Co Debt-to-Equity?

Shenzhen Ampron Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥294.6 Mil. Shenzhen Ampron Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥367.8 Mil. Shenzhen Ampron Technology Co's Total Stockholders Equity for the quarter that ended in Mar. 2024 was ¥1,161.0 Mil. Shenzhen Ampron Technology Co's debt to equity for the quarter that ended in Mar. 2024 was 0.57.

A high debt to equity ratio generally means that a company has been aggressive in financing its growth with debt. This can result in volatile earnings as a result of the additional interest expense.

The historical rank and industry rank for Shenzhen Ampron Technology Co's Debt-to-Equity or its related term are showing as below:

SZSE:301413' s Debt-to-Equity Range Over the Past 10 Years
Min: 0.08 Med: 0.57 Max: 1.23
Current: 0.57

During the past 6 years, the highest Debt-to-Equity Ratio of Shenzhen Ampron Technology Co was 1.23. The lowest was 0.08. And the median was 0.57.

SZSE:301413's Debt-to-Equity is ranked worse than
71.25% of 2191 companies
in the Hardware industry
Industry Median: 0.29 vs SZSE:301413: 0.57

Shenzhen Ampron Technology Co Debt-to-Equity Historical Data

The historical data trend for Shenzhen Ampron Technology Co's Debt-to-Equity can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Shenzhen Ampron Technology Co Debt-to-Equity Chart

Shenzhen Ampron Technology Co Annual Data

Trend

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Debt-to-Equity

Get a 7-Day Free Trial

0.08

0.16

0.47

1.04

0.59

Shenzhen Ampron Technology Co Quarterly Data
	Dec18	Dec19	Dec20	Mar21	Jun21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Debt-to-Equity	Get a 7-Day Free Trial										-	1.23	1.20	0.59	0.57

Competitive Comparison of Shenzhen Ampron Technology Co's Debt-to-Equity

For the Electronic Components subindustry, Shenzhen Ampron Technology Co's Debt-to-Equity, along with its competitors' market caps and Debt-to-Equity data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Shenzhen Ampron Technology Co's Debt-to-Equity Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Shenzhen Ampron Technology Co's Debt-to-Equity distribution charts can be found below:

* The bar in red indicates where Shenzhen Ampron Technology Co's Debt-to-Equity falls into.

Shenzhen Ampron Technology Co Debt-to-Equity Calculation

Debt to Equity measures the financial leverage a company has.

Shenzhen Ampron Technology Co's Debt to Equity Ratio for the fiscal year that ended in Dec. 2023 is calculated as

Debt to Equity	=	Total Debt			/	Total Stockholders Equity
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Stockholders Equity
	=	(287.491	+	387.684)	/	1148.218
	=	0.59

Shenzhen Ampron Technology Co's Debt to Equity Ratio for the quarter that ended in Mar. 2024 is calculated as

Debt to Equity	=	Total Debt			/	Total Stockholders Equity
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Stockholders Equity
	=	(294.564	+	367.814)	/	1160.99
	=	0.57

Shenzhen Ampron Technology Co (SZSE:301413) Debt-to-Equity Explanation

In the calculation of Debt to Equity, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Stockholders Equity. In some calculations, Total Liabilities is used to for calculation.

Be Aware

Because a company can increase its ROE % by having more financial leverage, it is important to watch the leverage ratio when investing in high ROE % companies.

Shenzhen Ampron Technology Co Debt-to-Equity Related Terms

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Shenzhen Ampron Technology Co (SZSE:301413) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Hardware » Shenzhen Ampron Technology Co Ltd (SZSE:301413) » Definitions » Debt-to-Equity

Comparable Companies

Traded in Other Exchanges

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Address

No. 1 Juyuan Road, Kengzi Street, Room 201, Building 1A/1B/2, Ampelon Intelligent Sensor Industrial Park, Jinsha Community, Pingshan, Guangdong, Shenzhen City, CHN

Website

https://www.ampron.com

Shenzhen Ampron Technology Co Ltd is engaged in engaged in research & development, manufacturing, sales and service of sensors. Its products include pressure sensors, oxygen sensors, etc. Sensors, temperature sensors, PTC thermistors, NTC thermistors, etc. The products are widely used in automobiles, smart homes, smart medical care, Internet of Things, consumer electronics, aerospace, industrial control and other fields.

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