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Shenzhen Ampron Technology Co (SZSE:301413) Short-Term Capital Lease Obligation : ¥0.0 Mil (As of Mar. 2024)


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What is Shenzhen Ampron Technology Co Short-Term Capital Lease Obligation?

Shenzhen Ampron Technology Co's Short-Term Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥0.0 Mil.


Shenzhen Ampron Technology Co Short-Term Capital Lease Obligation Historical Data

The historical data trend for Shenzhen Ampron Technology Co's Short-Term Capital Lease Obligation can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Shenzhen Ampron Technology Co Short-Term Capital Lease Obligation Chart

Shenzhen Ampron Technology Co Annual Data
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Shenzhen Ampron Technology Co Quarterly Data
Dec18 Dec19 Dec20 Mar21 Jun21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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Shenzhen Ampron Technology Co Short-Term Capital Lease Obligation Explanation

Short-Term Capital Lease Obligation represents the total amount of Long-Term Capital Lease Obligation that must be paid within the next accounting period. Capital lease obligations are contractual obligations that arise from obtaining the use of property or equipment via a capital lease contract.


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Shenzhen Ampron Technology Co (SZSE:301413) Business Description

Comparable Companies
Traded in Other Exchanges
N/A
Address
No. 1 Juyuan Road, Kengzi Street, Room 201, Building 1A/1B/2, Ampelon Intelligent Sensor Industrial Park, Jinsha Community, Pingshan, Guangdong, Shenzhen City, CHN
Shenzhen Ampron Technology Co Ltd is engaged in engaged in research & development, manufacturing, sales and service of sensors. Its products include pressure sensors, oxygen sensors, etc. Sensors, temperature sensors, PTC thermistors, NTC thermistors, etc. The products are widely used in automobiles, smart homes, smart medical care, Internet of Things, consumer electronics, aerospace, industrial control and other fields.

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