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Shenzhen Ampron Technology Co (SZSE:301413) Debt-to-EBITDA : 3.17 (As of Jun. 2024)


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What is Shenzhen Ampron Technology Co Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Shenzhen Ampron Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Jun. 2024 was ¥252.7 Mil. Shenzhen Ampron Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Jun. 2024 was ¥102.4 Mil. Shenzhen Ampron Technology Co's annualized EBITDA for the quarter that ended in Jun. 2024 was ¥112.0 Mil. Shenzhen Ampron Technology Co's annualized Debt-to-EBITDA for the quarter that ended in Jun. 2024 was 3.17.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Shenzhen Ampron Technology Co's Debt-to-EBITDA or its related term are showing as below:

SZSE:301413' s Debt-to-EBITDA Range Over the Past 10 Years
Min: 0.58   Med: 1.77   Max: 4.92
Current: 2.97

During the past 6 years, the highest Debt-to-EBITDA Ratio of Shenzhen Ampron Technology Co was 4.92. The lowest was 0.58. And the median was 1.77.

SZSE:301413's Debt-to-EBITDA is ranked worse than
65.3% of 1738 companies
in the Hardware industry
Industry Median: 1.885 vs SZSE:301413: 2.97

Shenzhen Ampron Technology Co Debt-to-EBITDA Historical Data

The historical data trend for Shenzhen Ampron Technology Co's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Shenzhen Ampron Technology Co Debt-to-EBITDA Chart

Shenzhen Ampron Technology Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-EBITDA
Get a 7-Day Free Trial 0.58 0.79 2.61 4.86 4.92

Shenzhen Ampron Technology Co Quarterly Data
Dec18 Dec19 Dec20 Mar21 Jun21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 6.40 5.15 4.43 8.59 3.17

Competitive Comparison of Shenzhen Ampron Technology Co's Debt-to-EBITDA

For the Electronic Components subindustry, Shenzhen Ampron Technology Co's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Shenzhen Ampron Technology Co's Debt-to-EBITDA Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Shenzhen Ampron Technology Co's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Shenzhen Ampron Technology Co's Debt-to-EBITDA falls into.



Shenzhen Ampron Technology Co Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Shenzhen Ampron Technology Co's Debt-to-EBITDA for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(287.491 + 387.684) / 137.378
=4.91

Shenzhen Ampron Technology Co's annualized Debt-to-EBITDA for the quarter that ended in Jun. 2024 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(252.698 + 102.406) / 111.984
=3.17

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Jun. 2024) EBITDA data.


Shenzhen Ampron Technology Co  (SZSE:301413) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


Shenzhen Ampron Technology Co Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Shenzhen Ampron Technology Co's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


Shenzhen Ampron Technology Co Business Description

Comparable Companies
Traded in Other Exchanges
N/A
Address
No. 1 Juyuan Road, Kengzi Street, Room 201, Building 1A/1B/2, Ampelon Intelligent Sensor Industrial Park, Jinsha Community, Pingshan, Guangdong, Shenzhen City, CHN
Shenzhen Ampron Technology Co Ltd is engaged in engaged in research & development, manufacturing, sales and service of sensors. Its products include pressure sensors, oxygen sensors, etc. Sensors, temperature sensors, PTC thermistors, NTC thermistors, etc. The products are widely used in automobiles, smart homes, smart medical care, Internet of Things, consumer electronics, aerospace, industrial control and other fields.

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