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SAMCO (TSE:6387) Institutional Ownership : 12.20% (As of May. 27, 2024)


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What is SAMCO Institutional Ownership?

Institutional ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, SAMCO's institutional ownership is 12.20%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, SAMCO's Insider Ownership is 0.00%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, SAMCO's Float Percentage Of Total Shares Outstanding is 0.00%.


SAMCO Institutional Ownership Historical Data

The historical data trend for SAMCO's Institutional Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

SAMCO Institutional Ownership Chart

SAMCO Historical Data

The historical data trend for SAMCO can be seen below:

2023-07-31 2023-08-31 2023-09-30 2023-10-31 2023-11-30 2023-12-31 2024-01-31 2024-02-29 2024-03-31 2024-04-30
Institutional Ownership 11.62 12.07 12.10 12.28 12.33 12.33 12.33 12.48 12.50 12.20

SAMCO Institutional Ownership Calculation

The percentage of shares that are owned by institutions out of the total shares outstanding.


SAMCO (TSE:6387) Business Description

Traded in Other Exchanges
Address
36 Waraya-cho, Takeda, Fushimi-ku, Kyoto, JPN, 612-8443
SAMCO Inc is engaged in the manufacturing and sales of semiconductor process equipment. It offers CVD equipment, dry etching equipment, dry cleaning equipment, and others in the field of optoelectronics such as LED and semiconductor lasers, electronic components such as MEMS and high-frequency devices, and semiconductor device fields such as 3D packages and defects analysis doing.

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