SAMCO (TSE:6387) Short-Term Debt : 円740 Mil (As of Jan. 2024)

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What is SAMCO Short-Term Debt?

SAMCO's Short-Term Debt for the quarter that ended in Jan. 2024 was 円740 Mil.

SAMCO's quarterly Short-Term Debt stayed the same from Jul. 2023 (円740 Mil) to Oct. 2023 (円740 Mil) and stayed the same from Oct. 2023 (円740 Mil) to Jan. 2024 (円740 Mil).

SAMCO's annual Short-Term Debt increased from Jul. 2021 (円700 Mil) to Jul. 2022 (円740 Mil) but then stayed the same from Jul. 2022 (円740 Mil) to Jul. 2023 (円740 Mil).

SAMCO Short-Term Debt Historical Data

The historical data trend for SAMCO's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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SAMCO Short-Term Debt Chart

SAMCO Annual Data

Trend

Jul14

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Jul23

Short-Term Debt

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700.00

740.00

SAMCO Quarterly Data
	Apr19	Jul19	Oct19	Jan20	Apr20	Jul20	Oct20	Jan21	Apr21	Jul21	Oct21	Jan22	Apr22	Jul22	Oct22	Jan23	Apr23	Jul23	Oct23	Jan24
Short-Term Debt	Get a 7-Day Free Trial															740.00	740.00	740.00	740.00	740.00

SAMCO Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.

SAMCO Short-Term Debt Related Terms

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SAMCO (TSE:6387) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » SAMCO Inc (TSE:6387) » Definitions » Short-Term Debt

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SMU:Germany

Address

36 Waraya-cho, Takeda, Fushimi-ku, Kyoto, JPN, 612-8443

Website

http://www.samco.co.jp

SAMCO Inc is engaged in the manufacturing and sales of semiconductor process equipment. It offers CVD equipment, dry etching equipment, dry cleaning equipment, and others in the field of optoelectronics such as LED and semiconductor lasers, electronic components such as MEMS and high-frequency devices, and semiconductor device fields such as 3D packages and defects analysis doing.

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