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Winbond Electronics (TPE:2344) LT-Debt-to-Total-Asset : 0.19 (As of Dec. 2024)


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What is Winbond Electronics LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. Winbond Electronics's long-term debt to total assests ratio for the quarter that ended in Dec. 2024 was 0.19.

Winbond Electronics's long-term debt to total assets ratio declined from Dec. 2023 (0.25) to Dec. 2024 (0.19). It may suggest that Winbond Electronics is progressively becoming less dependent on debt to grow their business.


Winbond Electronics LT-Debt-to-Total-Asset Historical Data

The historical data trend for Winbond Electronics's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Winbond Electronics LT-Debt-to-Total-Asset Chart

Winbond Electronics Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.19 0.17 0.25 0.25 0.19

Winbond Electronics Quarterly Data
Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.25 0.26 0.26 0.18 0.19

Winbond Electronics LT-Debt-to-Total-Asset Calculation

Winbond Electronics's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (A: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2024 )/Total Assets (A: Dec. 2024 )
=32931.689/177784.148
=0.19

Winbond Electronics's Long-Term Debt to Total Asset Ratio for the quarter that ended in Dec. 2024 is calculated as

LT Debt to Total Assets (Q: Dec. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Dec. 2024 )/Total Assets (Q: Dec. 2024 )
=32931.689/177784.148
=0.19

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Winbond Electronics  (TPE:2344) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


Winbond Electronics LT-Debt-to-Total-Asset Related Terms

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Winbond Electronics Business Description

Traded in Other Exchanges
N/A
Address
No. 8, Keya 1st Road, Daya District, Taichung, TWN
Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of very large scale integration (VLSI) integrated circuits (ICs) used in a variety of microelectronic applications. In addition, it offers customised memory solutions like Mobile RAM and Specialty DRAM, and core storage flash memory products. The company's operating segments are Customized Memory Solution product, Flash Memory product, and Logic IC product. Maximum revenue is generated from the Logic IC product segment, which engages mainly in the manufacturing, selling, researching, designing, and after-sales service of Logic IC products. Geographically, the company generates maximum revenue from Asia, followed by America, Europe, and Other regions.

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