Winbond Electronics (TPE:2344) Additional Paid-In Capital : NT$13,758 Mil(As of Mar. 2025)

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What is Winbond Electronics Additional Paid-In Capital?

Winbond Electronics's quarterly additional paid-in capital stayed the same from Sep. 2024 (NT$13,699 Mil) to Dec. 2024 (NT$13,699 Mil) but then increased from Dec. 2024 (NT$13,699 Mil) to Mar. 2025 (NT$13,758 Mil).

Winbond Electronics's annual additional paid-in capital increased from Dec. 2022 (NT$7,786 Mil) to Dec. 2023 (NT$10,136 Mil) and increased from Dec. 2023 (NT$10,136 Mil) to Dec. 2024 (NT$13,699 Mil).

Winbond Electronics Additional Paid-In Capital Historical Data

The historical data trend for Winbond Electronics's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Winbond Electronics Additional Paid-In Capital Chart

Winbond Electronics Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Additional Paid-In Capital

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7,770.87

7,786.12

7,785.92

10,135.87

13,699.05

Winbond Electronics Quarterly Data
	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24	Dec24	Mar25
Additional Paid-In Capital	Get a 7-Day Free Trial															10,135.88	10,135.88	13,699.05	13,699.05	13,757.78

Winbond Electronics Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital

(Issue Price

Par Value)

Shares Outstanding (Diluted Average)

Winbond Electronics Additional Paid-In Capital Related Terms

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Winbond Electronics Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Winbond Electronics Corp (TPE:2344) » Definitions » Additional Paid-In Capital

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 8, Keya 1st Road, Daya District, Taichung, TWN

Website

https://www.winbond.com

Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of very large scale integration (VLSI) integrated circuits (ICs) used in a variety of microelectronic applications. In addition, it offers customised memory solutions like Mobile RAM and Specialty DRAM, and core storage flash memory products. The company's operating segments are Customized Memory Solution product, Flash Memory product, and Logic IC product. Maximum revenue is generated from the Logic IC product segment, which engages mainly in the manufacturing, selling, researching, designing, and after-sales service of Logic IC products. Geographically, the company generates maximum revenue from Asia, followed by America, Europe, and Other regions.

Winbond Electronics Headlines

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