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Darbond Technology Co (SHSE:688035) Short-Term Debt : ¥114 Mil (As of Sep. 2024)


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What is Darbond Technology Co Short-Term Debt?

Darbond Technology Co's Short-Term Debt for the quarter that ended in Sep. 2024 was ¥114 Mil.

Darbond Technology Co's quarterly Short-Term Debt declined from Mar. 2024 (¥164 Mil) to Jun. 2024 (¥134 Mil) and declined from Jun. 2024 (¥134 Mil) to Sep. 2024 (¥114 Mil).

Darbond Technology Co's annual Short-Term Debt increased from Dec. 2021 (¥30 Mil) to Dec. 2022 (¥54 Mil) and increased from Dec. 2022 (¥54 Mil) to Dec. 2023 (¥90 Mil).


Darbond Technology Co Short-Term Debt Historical Data

The historical data trend for Darbond Technology Co's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Darbond Technology Co Short-Term Debt Chart

Darbond Technology Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Short-Term Debt
Get a 7-Day Free Trial 45.00 2.88 30.00 54.30 89.54

Darbond Technology Co Quarterly Data
Dec18 Dec19 Sep20 Dec20 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
Short-Term Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 29.54 89.54 164.39 134.39 114.39

Darbond Technology Co Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.


Darbond Technology Co Short-Term Debt Related Terms

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Darbond Technology Co Business Description

Traded in Other Exchanges
N/A
Address
No. 3-3, Kaifeng Road, Economic and Technological Development Zone, Shandong Province, Yantai, CHN, 265618
Darbond Technology Co Ltd is engaged in the research and development of high-end electronic packaging materials. It is mainly engaged in electronic packaging materials, thermal conductive materials, conductive materials, wafer dicing films, thin film and other more than 400 kinds of products.
Executives
Jiang Yun Core technical personnel

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