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Darbond Technology Co (SHSE:688035) Debt-to-Asset : 0.03 (As of Mar. 2025)


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What is Darbond Technology Co Debt-to-Asset?

Darbond Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥91 Mil. Darbond Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥3 Mil. Darbond Technology Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2025 was ¥3,021 Mil. Darbond Technology Co's debt to asset for the quarter that ended in Mar. 2025 was 0.03.


Darbond Technology Co Debt-to-Asset Historical Data

The historical data trend for Darbond Technology Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Darbond Technology Co Debt-to-Asset Chart

Darbond Technology Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Asset
Get a 7-Day Free Trial 0.02 0.09 0.04 0.05 0.04

Darbond Technology Co Quarterly Data
Dec18 Dec19 Sep20 Dec20 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.07 0.05 0.04 0.04 0.03

Competitive Comparison of Darbond Technology Co's Debt-to-Asset

For the Chemicals subindustry, Darbond Technology Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Darbond Technology Co's Debt-to-Asset Distribution in the Chemicals Industry

For the Chemicals industry and Basic Materials sector, Darbond Technology Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Darbond Technology Co's Debt-to-Asset falls into.


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Darbond Technology Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Darbond Technology Co's Debt-to-Asset for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(118.503 + 3.717) / 2969.733
=0.04

Darbond Technology Co's Debt-to-Asset for the quarter that ended in Mar. 2025 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(90.836 + 3.386) / 3021.178
=0.03

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Darbond Technology Co  (SHSE:688035) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Darbond Technology Co Debt-to-Asset Related Terms

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Darbond Technology Co Business Description

Traded in Other Exchanges
N/A
Address
No. 3-3, Kaifeng Road, Economic and Technological Development Zone, Shandong Province, Yantai, CHN, 265618
Darbond Technology Co Ltd is engaged in the research and development of high-end electronic packaging materials. It is mainly engaged in electronic packaging materials, thermal conductive materials, conductive materials, wafer dicing films, thin film and other more than 400 kinds of products.
Executives
Jiang Yun Core technical personnel

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