Taiwan Semiconductor Manufacturing Co (BUE:TSM) Additional Paid-In Capital : ARS2,153,175 Mil(As of Sep. 2024)

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What is Taiwan Semiconductor Manufacturing Co Additional Paid-In Capital?

Taiwan Semiconductor Manufacturing Co's quarterly additional paid-in capital increased from Mar. 2024 (ARS1,885,858 Mil) to Jun. 2024 (ARS1,962,126 Mil) and increased from Jun. 2024 (ARS1,962,126 Mil) to Sep. 2024 (ARS2,153,175 Mil).

Taiwan Semiconductor Manufacturing Co's annual additional paid-in capital increased from Dec. 2021 (ARS235,701 Mil) to Dec. 2022 (ARS379,195 Mil) and increased from Dec. 2022 (ARS379,195 Mil) to Dec. 2023 (ARS807,173 Mil).

Taiwan Semiconductor Manufacturing Co Additional Paid-In Capital Historical Data

The historical data trend for Taiwan Semiconductor Manufacturing Co's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Taiwan Semiconductor Manufacturing Co Additional Paid-In Capital Chart

Taiwan Semiconductor Manufacturing Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Additional Paid-In Capital

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111,293.39

162,590.90

235,701.32

379,194.59

807,173.43

Taiwan Semiconductor Manufacturing Co Quarterly Data
	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24	Jun24	Sep24
Additional Paid-In Capital	Get a 7-Day Free Trial															763,157.37	807,173.43	1,885,857.87	1,962,126.44	2,153,174.94

Taiwan Semiconductor Manufacturing Co Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital

(Issue Price

Par Value)

Shares Outstanding (Diluted Average)

Taiwan Semiconductor Manufacturing Co Additional Paid-In Capital Related Terms

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Taiwan Semiconductor Manufacturing Co Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Taiwan Semiconductor Manufacturing Co Ltd (BUE:TSM) » Definitions » Additional Paid-In Capital

Comparable Companies

Traded in Other Exchanges

TSM:USA 2330:Taiwan TSM N:Mexico 0LCV:UK TSFA:Germany TSFA:Germany TSMC34:Brazil TSFA:Bulgaria TSFA:Austria

Address

No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, TWN, 300-096

Website

https://www.tsmc.com

Taiwan Semiconductor Manufacturing Co. is the world's largest dedicated chip foundry, with over 60% market share. TSMC was founded in 1987 as a joint venture of Philips, the government of Taiwan, and private investors. It went public as an ADR in the us in 1997. TSMC's scale and high-quality technology allow the firm to generate solid operating margins, even in the highly competitive foundry business. Furthermore, the shift to the fabless business model has created tailwinds for TSMC. The foundry leader has an illustrious customer base, including Apple, AMD, and Nvidia, that looks to apply cutting-edge process technologies to its semiconductor designs. TSMC employs more than 73,000 people.