HISNF (Hi Sun Technology (China)) Additional Paid-In Capital : $158.4 Mil(As of Dec. 2024)

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What is Hi Sun Technology (China) Additional Paid-In Capital?

Hi Sun Technology (China)'s quarterly additional paid-in capital declined from Dec. 2023 ($157.7 Mil) to Jun. 2024 ($157.7 Mil) but then increased from Jun. 2024 ($157.7 Mil) to Dec. 2024 ($158.4 Mil).

Hi Sun Technology (China)'s annual additional paid-in capital declined from Dec. 2022 ($158.2 Mil) to Dec. 2023 ($157.7 Mil) but then increased from Dec. 2023 ($157.7 Mil) to Dec. 2024 ($158.4 Mil).

Hi Sun Technology (China) Additional Paid-In Capital Historical Data

The historical data trend for Hi Sun Technology (China)'s Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Hi Sun Technology (China) Additional Paid-In Capital Chart

Hi Sun Technology (China) Annual Data

Trend

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Dec24

Additional Paid-In Capital

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158.88

157.92

158.19

157.70

158.44

Hi Sun Technology (China) Semi-Annual Data
	Jun15	Dec15	Jun16	Dec16	Jun17	Dec17	Jun18	Dec18	Jun19	Dec19	Jun20	Dec20	Jun21	Dec21	Jun22	Dec22	Jun23	Dec23	Jun24	Dec24
Additional Paid-In Capital	Get a 7-Day Free Trial															158.19	157.23	157.70	157.69	158.44

Hi Sun Technology (China) Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital

(Issue Price

Par Value)

Shares Outstanding (Diluted Average)

Hi Sun Technology (China) Additional Paid-In Capital Related Terms

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Hi Sun Technology (China) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Software » Hi Sun Technology (China) Ltd (OTCPK:HISNF) » Definitions » Additional Paid-In Capital

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Traded in Other Exchanges

00818:Hong Kong

Address

30 Harbour Road, Room 2515, 25th Floor, Sun Hung Kai Centre, Wanchai, HKG

Website

http://www.hisun.com.hk

Hi Sun Technology (China) Ltd provides financial solutions with the help of its platform operations solution. The company's operating segments are payment and digital services, fintech services, Platform operation solutions, Financial solutions, and others. The payment processing solutions provide payment processing services and related digital products; Fintech Services provide micro-lending, supply chain financing, and related products and solutions, Platform operation solutions provide telecommunication and mobile payment platform operation services and operation value-added services; and the Financial solutions provide information system consultancy, sales of information technology products to financial institutions and banks. The geographical segments are Mainland China and Hong Kong.

Hi Sun Technology (China) Headlines

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