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Time Interconnect Technology (HKSE:01729) Additional Paid-In Capital : HK$330 Mil(As of Dec. 2024)


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What is Time Interconnect Technology Additional Paid-In Capital?


Time Interconnect Technology's quarterly additional paid-in capital stayed the same from Sep. 2023 (HK$323 Mil) to Jun. 2024 (HK$323 Mil) but then increased from Jun. 2024 (HK$323 Mil) to Dec. 2024 (HK$330 Mil).

Time Interconnect Technology's annual additional paid-in capital increased from Mar. 2022 (HK$0 Mil) to Mar. 2023 (HK$323 Mil) and increased from Mar. 2023 (HK$323 Mil) to Dec. 2024 (HK$330 Mil).


Time Interconnect Technology Additional Paid-In Capital Historical Data

The historical data trend for Time Interconnect Technology's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Time Interconnect Technology Additional Paid-In Capital Chart

Time Interconnect Technology Annual Data
Trend Mar15 Mar16 Mar17 Mar18 Mar19 Mar20 Mar21 Mar22 Mar23 Dec24
Additional Paid-In Capital
Get a 7-Day Free Trial Premium Member Only Premium Member Only - - - 323.49 329.71

Time Interconnect Technology Semi-Annual Data
Mar15 Mar16 Mar17 Sep17 Mar18 Sep18 Mar19 Sep19 Mar20 Sep20 Mar21 Sep21 Mar22 Sep22 Mar23 Sep23 Jun24 Dec24
Additional Paid-In Capital Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - 323.49 323.49 323.49 329.71

Time Interconnect Technology Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)* Shares Outstanding (Diluted Average)

Time Interconnect Technology Additional Paid-In Capital Related Terms

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Time Interconnect Technology Business Description

Traded in Other Exchanges
Address
5 Science Park East Avenue, Units 213-221, 2/F, Building 5E, Hong Kong Science Park, Shatin, Hong Kong, HKG
Time Interconnect Technology Ltd is an investment holding company. The company operates in the manufacture and sales of a wide variety of copper, digital cable products, & optical fiber cable assemblies. The firm is organized into two main operating divisions Cable assembly, Digital cables, and Server. The company generates revenue from the Server segment which includes manufacturing and trading of server products. Geographically, the company derives a majority of its revenue from China and also has a presence in the United States of America; Netherlands; Singapore; Hong Kong, Mexico, United Kingdom and Other Countries. The company serves Telecommunication and Data Communication; Healthcare and Transportation and Industrial markets.
Executives
Wang Laichun 2201 Interest of corporation controlled by you
Wang Laisheng 2201 Interest of corporation controlled by you
Li Xun You Xian Gong Si 2201 Interest of corporation controlled by you
Li Xun Jing Mi Gong Ye Gu Fen You Xian Gong Si 2201 Interest of corporation controlled by you

Time Interconnect Technology Headlines

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