TongFu Microelectronics Co (SZSE:002156) Asset Impairment Charge : ¥0 Mil (TTM As of Mar. 2024)

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What is TongFu Microelectronics Co Asset Impairment Charge?

TongFu Microelectronics Co's Asset Impairment Charge for the three months ended in Mar. 2024 was ¥0 Mil. Its Asset Impairment Charge for the trailing twelve months (TTM) ended in Mar. 2024 was ¥0 Mil.

TongFu Microelectronics Co Asset Impairment Charge Historical Data

The historical data trend for TongFu Microelectronics Co's Asset Impairment Charge can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
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TongFu Microelectronics Co Asset Impairment Charge Chart

TongFu Microelectronics Co Annual Data

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Asset Impairment Charge

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TongFu Microelectronics Co Quarterly Data
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TongFu Microelectronics Co Asset Impairment Charge Calculation

Asset Impairment Charge is the charge against earnings resulting from the aggregate write down of all assets from their carrying value to their fair value.

Asset Impairment Charge for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0 Mil.

TongFu Microelectronics Co Asset Impairment Charge Related Terms

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TongFu Microelectronics Co (SZSE:002156) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » TongFu Microelectronics Co Ltd (SZSE:002156) » Definitions » Asset Impairment Charge

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006

Website

https://www.tfme.com

TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

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