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TongFu Microelectronics Co (SZSE:002156) Buildings And Improvements : ¥0 Mil (As of Mar. 2024)


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What is TongFu Microelectronics Co Buildings And Improvements?

TongFu Microelectronics Co Buildings And Improvements Historical Data

The historical data trend for TongFu Microelectronics Co's Buildings And Improvements can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
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TongFu Microelectronics Co Buildings And Improvements Chart

TongFu Microelectronics Co Annual Data
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Buildings And Improvements
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TongFu Microelectronics Co Quarterly Data
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TongFu Microelectronics Co Buildings And Improvements Calculation

Buildings are typically valued at the time of acquisition or construction.  Broker and architect fees, permits, etc. can be covered within this category.  Building components, such as a roof, are normally recorded separately in an asset register since the value and useful lives of these components equal much less than the building itself.

Building improvements that extend the useful life of a building will fall into the category of “building improvements” and should be capitalized.  Improvements are commonly recorded at acquisition cost.  Building improvement examples include roofing, remodeling, replacements, etc.

TongFu Microelectronics Co (SZSE:002156) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » TongFu Microelectronics Co Ltd (SZSE:002156) » Definitions » Buildings And Improvements
Comparable Companies
SZSE:300751 SZSE:002409 SHSE:688072 SHSE:688082 SHSE:688126 SHSE:688120 SZSE:002185 SHSE:603290 SHSE:688234 SHSE:688516 XAMS:ASML AMAT LRCX TSE:8035 KLAC XAMS:ASM TSE:6146 TSE:6857 SZSE:002371 ENTG
Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
Website
https://www.tfme.com
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

TongFu Microelectronics Co (SZSE:002156) Headlines

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