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TongFu Microelectronics Co (SZSE:002156) Current Deferred Taxes Liabilities : ¥0 Mil (As of Mar. 2024)


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What is TongFu Microelectronics Co Current Deferred Taxes Liabilities?

Current Deferred Taxes Liabilities represent future tax liabilities, resulting from temporary differences between book (accounting) value of assets and liabilities and their tax value, or timing differences between the recognition of gains and losses in financial statements and their recognition in a tax computation. Deferred tax liabilities generally arise where tax relief is provided in advance of an accounting expense, or income is accrued but not taxed until received.

TongFu Microelectronics Co's current deferred tax liabilities for the quarter that ended in Mar. 2024 was ¥0 Mil.

TongFu Microelectronics Co Current Deferred Taxes Liabilities Historical Data

The historical data trend for TongFu Microelectronics Co's Current Deferred Taxes Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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TongFu Microelectronics Co Current Deferred Taxes Liabilities Chart

TongFu Microelectronics Co Annual Data
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Current Deferred Taxes Liabilities
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TongFu Microelectronics Co Quarterly Data
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TongFu Microelectronics Co (SZSE:002156) Business Description

Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

TongFu Microelectronics Co (SZSE:002156) Headlines

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