TongFu Microelectronics Co (SZSE:002156) Change In Receivables : ¥0 Mil (TTM As of Mar. 2024)

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What is TongFu Microelectronics Co Change In Receivables?

TongFu Microelectronics Co's change in receivables for the quarter that ended in Mar. 2024 was ¥0 Mil. It means TongFu Microelectronics Co's Accounts Receivable stayed the same from Dec. 2023 to Mar. 2024 .

TongFu Microelectronics Co's change in receivables for the fiscal year that ended in Dec. 2023 was ¥656 Mil. It means TongFu Microelectronics Co's Accounts Receivable declined by ¥656 Mil from Dec. 2022 to Dec. 2023 .

TongFu Microelectronics Co's Accounts Receivable for the quarter that ended in Mar. 2024 was ¥4,213 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. TongFu Microelectronics Co's Days Sales Outstanding for the three months ended in Mar. 2024 was 72.79.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. TongFu Microelectronics Co's liquidation value for the three months ended in Mar. 2024 was ¥-10,962 Mil.

TongFu Microelectronics Co Change In Receivables Historical Data

The historical data trend for TongFu Microelectronics Co's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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TongFu Microelectronics Co Change In Receivables Chart

TongFu Microelectronics Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Change In Receivables

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129.99

-249.82

-761.78

-2,660.39

656.28

TongFu Microelectronics Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Change In Receivables	Get a 7-Day Free Trial															-	-	-	-	-

TongFu Microelectronics Co Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0 Mil.

TongFu Microelectronics Co (SZSE:002156) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

TongFu Microelectronics Co's Days Sales Outstanding for the quarter that ended in Mar. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	4213.419	/	5282.024	*	91
=	72.79

2. In Ben Graham's calculation of liquidation value, TongFu Microelectronics Co's accounts receivable are only considered to be worth 75% of book value:

TongFu Microelectronics Co's liquidation value for the quarter that ended in Mar. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	4479.694	-	20200.195	+	0.75 * 4213.419	+	0.5 * 3197.461
=	-10,962

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TongFu Microelectronics Co (SZSE:002156) Business Description

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Address

No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006

Website

https://www.tfme.com

TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

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