TongFu Microelectronics Co (SZSE:002156) Total Liabilities : ¥20,200 Mil (As of Mar. 2024)

View and export this data going back to 2007. Start your Free Trial

What is TongFu Microelectronics Co Total Liabilities?

TongFu Microelectronics Co's Total Liabilities for the quarter that ended in Mar. 2024 was ¥20,200 Mil.

TongFu Microelectronics Co's quarterly Total Liabilities declined from Sep. 2023 (¥20,932.41 Mil) to Dec. 2023 (¥20,183.87 Mil) but then increased from Dec. 2023 (¥20,183.87 Mil) to Mar. 2024 (¥20,200.20 Mil).

TongFu Microelectronics Co's annual Total Liabilities increased from Dec. 2021 (¥16,078.67 Mil) to Dec. 2022 (¥21,075.81 Mil) but then declined from Dec. 2022 (¥21,075.81 Mil) to Dec. 2023 (¥20,183.87 Mil).

TongFu Microelectronics Co Total Liabilities Historical Data

The historical data trend for TongFu Microelectronics Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

TongFu Microelectronics Co Total Liabilities Chart

TongFu Microelectronics Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Total Liabilities

Get a 7-Day Free Trial

9,654.98

11,215.80

16,078.67

21,075.81

20,183.87

TongFu Microelectronics Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Total Liabilities	Get a 7-Day Free Trial															21,461.13	19,817.60	20,932.41	20,183.87	20,200.20

TongFu Microelectronics Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

TongFu Microelectronics Co's Total Liabilities for the fiscal year that ended in Dec. 2023 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	12987.149	+	(6002.589	+	1194.13
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	0)
	=	20,184

Total Liabilities	=	Total Assets (A: Dec. 2023 )	-	Total Equity (A: Dec. 2023 )
	=	34877.71	-	14693.842
	=	20,184

TongFu Microelectronics Co's Total Liabilities for the quarter that ended in Mar. 2024 is calculated as

Total Liabilities	=	Total Current Liabilities	+	Total Noncurrent Liabilities
	=	Total Current Liabilities	+	(Long-Term Debt & Capital Lease Obligation	+	Other Long-Term Liabilities
	=	12151.494	+	(6889.554	+	1159.147
	+	NonCurrent Deferred Liabilities	+	PensionAndRetirementBenefit)
	+	0	+	0)
	=	20,200

Total Liabilities	=	Total Assets (Q: Mar. 2024 )	-	Total Equity (Q: Mar. 2024 )
	=	35020.876	-	14820.681
	=	20,200

TongFu Microelectronics Co Total Liabilities Related Terms

Thank you for viewing the detailed overview of TongFu Microelectronics Co's Total Liabilities provided by GuruFocus.com. Please click on the following links to see related term pages.

TongFu Microelectronics Co (SZSE:002156) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » TongFu Microelectronics Co Ltd (SZSE:002156) » Definitions » Total Liabilities

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006

Website

https://www.tfme.com

TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

TongFu Microelectronics Co (SZSE:002156) Headlines

No Headlines