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Beijing Relpow Technology Co (SZSE:300593) Debt-to-Asset : 0.30 (As of Mar. 2025)


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What is Beijing Relpow Technology Co Debt-to-Asset?

Beijing Relpow Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥478.2 Mil. Beijing Relpow Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥847.6 Mil. Beijing Relpow Technology Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2025 was ¥4,435.2 Mil. Beijing Relpow Technology Co's debt to asset for the quarter that ended in Mar. 2025 was 0.30.


Beijing Relpow Technology Co Debt-to-Asset Historical Data

The historical data trend for Beijing Relpow Technology Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Beijing Relpow Technology Co Debt-to-Asset Chart

Beijing Relpow Technology Co Annual Data
Trend Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23 Dec24
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.24 0.24 0.15 0.18 0.27

Beijing Relpow Technology Co Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.19 0.21 0.22 0.27 0.30

Competitive Comparison of Beijing Relpow Technology Co's Debt-to-Asset

For the Electrical Equipment & Parts subindustry, Beijing Relpow Technology Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Beijing Relpow Technology Co's Debt-to-Asset Distribution in the Industrial Products Industry

For the Industrial Products industry and Industrials sector, Beijing Relpow Technology Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Beijing Relpow Technology Co's Debt-to-Asset falls into.


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Beijing Relpow Technology Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Beijing Relpow Technology Co's Debt-to-Asset for the fiscal year that ended in Dec. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(507.104 + 633.193) / 4282.107
=0.27

Beijing Relpow Technology Co's Debt-to-Asset for the quarter that ended in Mar. 2025 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(478.195 + 847.609) / 4435.24
=0.30

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Beijing Relpow Technology Co  (SZSE:300593) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Beijing Relpow Technology Co Debt-to-Asset Related Terms

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Beijing Relpow Technology Co Business Description

Traded in Other Exchanges
N/A
Address
Building 1, No. 139, Shuangying Middle Road, Science Park, Changping District, Beijing, CHN, 102200
Beijing Relpow Technology Co Ltd is engaged in development of chip power supplies, module power supplies, customized power supplies and embedded power systems. The company's products include: chip power supply (micromodule), module power supply (thick film hybrid integrated circuit, microcircuit DC/DC and AC/DC, surge suppressor and filter), customized power supply (CPCI/VPX power supply, power inverter Power supply, special power supply for electric power, special power supply for railway, POE power supply), high-power power supply (high-power air-cooled/liquid-cooled power supply, communication rectifier and embedded power supply system).
Executives
Du Yong Sheng Directors, executives
Zheng Gang Director
Qiu Jin Hui Director
Zhou Quan Supervisors
Wang Bin Directors, executives

Beijing Relpow Technology Co Headlines

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