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Shenzhen Fine Made Electronics Group Co (SZSE:300671) Debt-to-Asset : 0.27 (As of Mar. 2025)


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What is Shenzhen Fine Made Electronics Group Co Debt-to-Asset?

Shenzhen Fine Made Electronics Group Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥631.4 Mil. Shenzhen Fine Made Electronics Group Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2025 was ¥88.5 Mil. Shenzhen Fine Made Electronics Group Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2025 was ¥2,638.8 Mil. Shenzhen Fine Made Electronics Group Co's debt to asset for the quarter that ended in Mar. 2025 was 0.27.


Shenzhen Fine Made Electronics Group Co Debt-to-Asset Historical Data

The historical data trend for Shenzhen Fine Made Electronics Group Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Shenzhen Fine Made Electronics Group Co Debt-to-Asset Chart

Shenzhen Fine Made Electronics Group Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.21 0.18 0.11 0.25 0.27

Shenzhen Fine Made Electronics Group Co Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24 Dec24 Mar25
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.24 0.23 0.21 0.25 0.27

Competitive Comparison of Shenzhen Fine Made Electronics Group Co's Debt-to-Asset

For the Semiconductors subindustry, Shenzhen Fine Made Electronics Group Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Shenzhen Fine Made Electronics Group Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Shenzhen Fine Made Electronics Group Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Shenzhen Fine Made Electronics Group Co's Debt-to-Asset falls into.


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Shenzhen Fine Made Electronics Group Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Shenzhen Fine Made Electronics Group Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(662.031 + 109.61) / 2913.712
=0.26

Shenzhen Fine Made Electronics Group Co's Debt-to-Asset for the quarter that ended in Mar. 2025 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(631.444 + 88.491) / 2638.76
=0.27

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Shenzhen Fine Made Electronics Group Co  (SZSE:300671) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Shenzhen Fine Made Electronics Group Co Debt-to-Asset Related Terms

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Shenzhen Fine Made Electronics Group Co Business Description

Traded in Other Exchanges
N/A
Address
18th Floor, West District, Times Technology Building, Nongyuan Road, Xiangmihu Street, Futian District, Guangdong Province, Shenzhen, CHN, 518048
Shenzhen Fine Made Electronics Group Co Ltd is an integrated circuit design enterprises. It is engaged in the design, research and development, production and operation of high-performance analog and digital-analog hybrid integrated circuits. Its product portfolio comprises power management, LED control and drive, MOSFET class, infrared remote control class and other consumer products.
Executives
Xu Zhe Director
Hao Zhai Ling Director
Li Zhi Xiong Supervisors
Chen Ying Supervisors
Wang Qiu Juan Director
Xi Guo Ping Supervisors
Guo Jing Director
Luo Qiong Directors, Directors, and Executives
Xiao Ting Feng Securities Affairs Representative
Chen Ke Hong Director

Shenzhen Fine Made Electronics Group Co Headlines

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