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Kyoeingyo Co (TSE:6973) Debt-to-Asset : 0.21 (As of Sep. 2024)


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What is Kyoeingyo Co Debt-to-Asset?

Kyoeingyo Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was 円4,712 Mil. Kyoeingyo Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was 円3,184 Mil. Kyoeingyo Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Sep. 2024 was 円37,218 Mil. Kyoeingyo Co's debt to asset for the quarter that ended in Sep. 2024 was 0.21.


Kyoeingyo Co Debt-to-Asset Historical Data

The historical data trend for Kyoeingyo Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Kyoeingyo Co Debt-to-Asset Chart

Kyoeingyo Co Annual Data
Trend Mar15 Mar16 Mar17 Mar18 Mar19 Mar20 Mar21 Mar22 Mar23 Mar24
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.27 0.24 0.21 0.25 0.21

Kyoeingyo Co Quarterly Data
Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Sep24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.23 0.22 0.23 0.21 0.21

Competitive Comparison of Kyoeingyo Co's Debt-to-Asset

For the Semiconductors subindustry, Kyoeingyo Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Kyoeingyo Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Kyoeingyo Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Kyoeingyo Co's Debt-to-Asset falls into.



Kyoeingyo Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Kyoeingyo Co's Debt-to-Asset for the fiscal year that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(5444.901 + 3233.087) / 42271.009
=0.21

Kyoeingyo Co's Debt-to-Asset for the quarter that ended in Sep. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(4712 + 3184) / 37218.291
=0.21

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Kyoeingyo Co  (TSE:6973) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Kyoeingyo Co Debt-to-Asset Related Terms

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Kyoeingyo Co Business Description

Traded in Other Exchanges
N/A
Address
20-4, 2chome, Shoto, Shibuya-ku, Tokyo, JPN, 150-8585
Kyoei Sangyo Co Ltd is a trading company dealing with various electronics related products. The company operates in three business segments - Trading, Software Development and Manufacturing. The Trading segment is involved in the sale of semiconductors, electronic devices, metal materials, industrial equipment, information communication equipment, and environmentally friendly products. The Software Development is involved in the development of software applications, system solutions, embedded systems, IC design for specific industries. The Manufacturing segment is engaged in the production and distribution of printed wiring board, information communication equipment, among others.

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