Nano Electronics and Micro System Technology (ROCO:7730) Debt-to-EBITDA : 1.34 (As of Jun. 2024)

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What is Nano Electronics and Micro System Technology Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Nano Electronics and Micro System Technology's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Jun. 2024 was NT$14.9 Mil. Nano Electronics and Micro System Technology's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Jun. 2024 was NT$152.3 Mil. Nano Electronics and Micro System Technology's annualized EBITDA for the quarter that ended in Jun. 2024 was NT$124.6 Mil. Nano Electronics and Micro System Technology's annualized Debt-to-EBITDA for the quarter that ended in Jun. 2024 was 1.34.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Nano Electronics and Micro System Technology's Debt-to-EBITDA or its related term are showing as below:

ROCO:7730' s Debt-to-EBITDA Range Over the Past 10 Years
Min: 0.78 Med: 1.59 Max: 2.54
Current: 1.13

During the past 5 years, the highest Debt-to-EBITDA Ratio of Nano Electronics and Micro System Technology was 2.54. The lowest was 0.78. And the median was 1.59.

ROCO:7730's Debt-to-EBITDA is ranked better than
60.1% of 2273 companies
in the Industrial Products industry
Industry Median: 1.68 vs ROCO:7730: 1.13

Nano Electronics and Micro System Technology Debt-to-EBITDA Historical Data

The historical data trend for Nano Electronics and Micro System Technology's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Nano Electronics and Micro System Technology Debt-to-EBITDA Chart

Nano Electronics and Micro System Technology Annual Data

Trend

Dec19

Dec20

Dec21

Dec22

Dec23

Debt-to-EBITDA

N/A

2.54

2.27

0.78

0.91

Nano Electronics and Micro System Technology Semi-Annual Data
	Dec20	Dec21	Jun22	Dec22	Jun23	Dec23	Jun24
Debt-to-EBITDA	Get a 7-Day Free Trial			-	0.52	0.86	1.01	1.34

Competitive Comparison of Nano Electronics and Micro System Technology's Debt-to-EBITDA

For the Specialty Industrial Machinery subindustry, Nano Electronics and Micro System Technology's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Nano Electronics and Micro System Technology's Debt-to-EBITDA Distribution in the Industrial Products Industry

For the Industrial Products industry and Industrials sector, Nano Electronics and Micro System Technology's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Nano Electronics and Micro System Technology's Debt-to-EBITDA falls into.

Nano Electronics and Micro System Technology Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Nano Electronics and Micro System Technology's Debt-to-EBITDA for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-EBITDA	=	Total Debt			/	EBITDA
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	EBITDA
	=	(11.034	+	161.397)	/	188.864
	=	0.91

Nano Electronics and Micro System Technology's annualized Debt-to-EBITDA for the quarter that ended in Jun. 2024 is calculated as

Debt-to-EBITDA	=	Total Debt			/	EBITDA
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	EBITDA
	=	(14.909	+	152.277)	/	124.616
	=	1.34

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is two times the quarterly (Jun. 2024) EBITDA data.

Nano Electronics and Micro System Technology (ROCO:7730) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.

Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

Nano Electronics and Micro System Technology Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Nano Electronics and Micro System Technology's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.

Nano Electronics and Micro System Technology Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Industrials » Industrial Products » Nano Electronics and Micro System Technology Inc (ROCO:7730) » Definitions » Debt-to-EBITDA

Comparable Companies

Traded in Other Exchanges

N/A

Address

No.100, Keji 5th Road, Tainan Technology Industrial Park, Annan District, Tainan, TWN, 709035

Website

https://www.nemstek.com.tw

Nano Electronics and Micro System Technology Inc is a company focused on the research and development of plasma technology. The company takes cutting-edge technical services as its purpose, and aims to provide high-efficiency industrial-grade surface treatment solutions. The company's main equipment focuses on dry equipment for plasma surface treatment, which can perform surface cleaning, surface modification (Modification), surface etching, and even surface treatment of materials. Drilling is performed on special polymer materials.

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