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New Power Plasma Co (XKRX:144960) Institutional Ownership : 0.98% (As of May. 07, 2025)


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What is New Power Plasma Co Institutional Ownership?

Institutional ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, New Power Plasma Co's institutional ownership is 0.98%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, New Power Plasma Co's Insider Ownership is 0.00%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, New Power Plasma Co's Float Percentage Of Total Shares Outstanding is 0.00%.


New Power Plasma Co Institutional Ownership Historical Data

The historical data trend for New Power Plasma Co's Institutional Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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New Power Plasma Co Institutional Ownership Chart

New Power Plasma Co Historical Data

The historical data trend for New Power Plasma Co can be seen below:

2024-07-31 2024-08-31 2024-09-30 2024-10-31 2024-11-30 2024-12-31 2025-01-31 2025-02-28 2025-03-31 2025-04-30
Institutional Ownership 0.99 1.05 1.05 1.04 1.04 1.04 1.05 1.06 1.06 0.98

New Power Plasma Co Institutional Ownership Calculation

The percentage of shares that are owned by institutions out of the total shares outstanding.


New Power Plasma Co Business Description

Traded in Other Exchanges
N/A
Address
1198-7, Baran-ro, Seotan-myeon, Gyeonggi-do, Pyeongtaek, KOR, 451-852
New Power Plasma Co Ltd develops RF generator, matching network, remote plasma generator and plasma power systems and sources. Products portfolio include power control, flexibility, stability, and reliability required by Etch, CVD and related processes.

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