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Zen Voce (ROCO:3581) NonCurrent Deferred Liabilities : NT$0 Mil (As of Mar. 2024)


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What is Zen Voce NonCurrent Deferred Liabilities?

Non-Current Deferred Liabilities represents the non-current portion of obligations, which is a liability that usually would have been paid but is now pas due.

Zen Voce's non-current deferred liabilities for the quarter that ended in Mar. 2024 was NT$0 Mil.

Zen Voce NonCurrent Deferred Liabilities Historical Data

The historical data trend for Zen Voce's NonCurrent Deferred Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Zen Voce NonCurrent Deferred Liabilities Chart

Zen Voce Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
NonCurrent Deferred Liabilities
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Zen Voce Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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Zen Voce NonCurrent Deferred Liabilities Related Terms

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Zen Voce (ROCO:3581) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Zen Voce Corp (ROCO:3581) » Definitions » NonCurrent Deferred Liabilities
Comparable Companies
ROCO:3567 TPE:6573 TPE:2434 ROCO:5344 ROCO:3259 ROCO:5262 ROCO:8277 ROCO:4923 ROCO:6739 ROCO:6786 NVDA TPE:2330 AVGO AMD INTC TXN QCOM ADI MU XKRX:000660
Traded in Other Exchanges
N/A
Address
No. 53, Jinggong Road, Sinfong Township, Hsinchu, TWN, 30441
Website
http://www.zenvoce.com
Zen Voce Corp is a Taiwan based company engaged in the business of providing semiconductor, optoelectronics and MEMS and LCD's equipment. It offers equipment products which include IC packaging machine design and manufacture of bumping, wafer cutting machine and cleaning machine design and manufacturing, and board cutting machine and cleaning machine design and manufacturing. The test products provided by the company includes Wafer test probe card PCB design and manufacturing, IC test HIFIX and CHANG KIT design and manufacturing, SOCKET IC design and manufacturing test, Acting IC HANDLER, and Acting SOCKET IC burn-in test.

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