Zen Voce (ROCO:3581) Current Deferred Taxes Liabilities : NT$0 Mil (As of Mar. 2024)

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What is Zen Voce Current Deferred Taxes Liabilities?

Current Deferred Taxes Liabilities represent future tax liabilities, resulting from temporary differences between book (accounting) value of assets and liabilities and their tax value, or timing differences between the recognition of gains and losses in financial statements and their recognition in a tax computation. Deferred tax liabilities generally arise where tax relief is provided in advance of an accounting expense, or income is accrued but not taxed until received.

Zen Voce's current deferred tax liabilities for the quarter that ended in Mar. 2024 was NT$0 Mil.

Zen Voce Current Deferred Taxes Liabilities Historical Data

The historical data trend for Zen Voce's Current Deferred Taxes Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Zen Voce Current Deferred Taxes Liabilities Chart

Zen Voce Annual Data

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Current Deferred Taxes Liabilities

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Zen Voce Quarterly Data
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Zen Voce (ROCO:3581) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Zen Voce Corp (ROCO:3581) » Definitions » Current Deferred Taxes Liabilities

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Address

No. 53, Jinggong Road, Sinfong Township, Hsinchu, TWN, 30441

Website

http://www.zenvoce.com

Zen Voce Corp is a Taiwan based company engaged in the business of providing semiconductor, optoelectronics and MEMS and LCD's equipment. It offers equipment products which include IC packaging machine design and manufacture of bumping, wafer cutting machine and cleaning machine design and manufacturing, and board cutting machine and cleaning machine design and manufacturing. The test products provided by the company includes Wafer test probe card PCB design and manufacturing, IC test HIFIX and CHANG KIT design and manufacturing, SOCKET IC design and manufacturing test, Acting IC HANDLER, and Acting SOCKET IC burn-in test.

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