Zen Voce (ROCO:3581) Short-Term Debt : NT$460 Mil (As of Mar. 2024)

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What is Zen Voce Short-Term Debt?

Zen Voce's Short-Term Debt for the quarter that ended in Mar. 2024 was NT$460 Mil.

Zen Voce's quarterly Short-Term Debt increased from Sep. 2023 (NT$460 Mil) to Dec. 2023 (NT$480 Mil) but then declined from Dec. 2023 (NT$480 Mil) to Mar. 2024 (NT$460 Mil).

Zen Voce's annual Short-Term Debt increased from Dec. 2021 (NT$417 Mil) to Dec. 2022 (NT$470 Mil) and increased from Dec. 2022 (NT$470 Mil) to Dec. 2023 (NT$480 Mil).

Zen Voce Short-Term Debt Historical Data

The historical data trend for Zen Voce's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Zen Voce Short-Term Debt Chart

Zen Voce Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Short-Term Debt

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327.06

367.10

417.07

470.01

480.01

Zen Voce Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Short-Term Debt	Get a 7-Day Free Trial															480.01	450.01	460.01	480.01	460.01

Zen Voce Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.

Zen Voce Short-Term Debt Related Terms

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Zen Voce (ROCO:3581) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Zen Voce Corp (ROCO:3581) » Definitions » Short-Term Debt

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 53, Jinggong Road, Sinfong Township, Hsinchu, TWN, 30441

Website

http://www.zenvoce.com

Zen Voce Corp is a Taiwan based company engaged in the business of providing semiconductor, optoelectronics and MEMS and LCD's equipment. It offers equipment products which include IC packaging machine design and manufacture of bumping, wafer cutting machine and cleaning machine design and manufacturing, and board cutting machine and cleaning machine design and manufacturing. The test products provided by the company includes Wafer test probe card PCB design and manufacturing, IC test HIFIX and CHANG KIT design and manufacturing, SOCKET IC design and manufacturing test, Acting IC HANDLER, and Acting SOCKET IC burn-in test.

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