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TongFu Microelectronics Co (SZSE:002156) Valuation Rank


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What is TongFu Microelectronics Co Valuation Rank?

The Valuation Rank measures the current valuation of a business relative to other companies in the same industry and its own historical valuation. The companies are split in equal numbers and then ranked from 1 to 10, with 10 as the most undervalued and 1 as the most overvalued.

  1. Three factors:
    • Absolute valuation (medpsvalue) relative to current stock price, rank among all companies
    • Historical valuation over the past 10 years. Rank pe, ps, pocf, ev2ebit over their own historical values
    • Industry relative valuation
  2. Companies without enough data is not ranked
  3. Companies with negative earnings are ranked lower

These three factors are used to calculate the value score for every eligible company, with values from 1 to 10. The final ranked companies are split in equal numbers and ranked from 1 to 10, with 10 as the most undervalued, and 1 as the most overvalued. The numbers of companies in each rank are the same.

TongFu Microelectronics Co Valuation Rank Related Terms

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TongFu Microelectronics Co (SZSE:002156) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » TongFu Microelectronics Co Ltd (SZSE:002156) » Definitions » Valuation Rank
Comparable Companies
SZSE:300751 SZSE:002409 SHSE:688072 SHSE:688082 SHSE:688126 SHSE:688120 SZSE:002185 SHSE:603290 SHSE:688234 SHSE:688516 XAMS:ASML AMAT LRCX TSE:8035 KLAC XAMS:ASM TSE:6146 TSE:6857 SZSE:002371 ENTG
Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
Website
https://www.tfme.com
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.
Executives
Zhang Xiao Ping Executives
Shi Lei Directors, executives
Gao Feng Directors, executives
Xia Xin Directors, executives
Jiang Shu Directors, executives
Zhu Hong Chao Executives
Shi Ming Da Director
Qian Jian Zhong Executives
Dai Yu Feng Supervisors