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Mimasu Semiconductor Industry Co (TSE:8155) Total Liabilities : 円39,592 Mil (As of May. 2024)


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What is Mimasu Semiconductor Industry Co Total Liabilities?

Mimasu Semiconductor Industry Co's Total Liabilities for the quarter that ended in May. 2024 was 円39,592 Mil.

Mimasu Semiconductor Industry Co's quarterly Total Liabilities declined from Nov. 2023 (円39,529.00 Mil) to Feb. 2024 (円35,577.00 Mil) but then increased from Feb. 2024 (円35,577.00 Mil) to May. 2024 (円39,592.00 Mil).

Mimasu Semiconductor Industry Co's annual Total Liabilities increased from May. 2022 (円33,677.00 Mil) to May. 2023 (円47,943.00 Mil) but then declined from May. 2023 (円47,943.00 Mil) to May. 2024 (円39,592.00 Mil).


Mimasu Semiconductor Industry Co Total Liabilities Historical Data

The historical data trend for Mimasu Semiconductor Industry Co's Total Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Mimasu Semiconductor Industry Co Total Liabilities Chart

Mimasu Semiconductor Industry Co Annual Data
Trend May15 May16 May17 May18 May19 May20 May21 May22 May23 May24
Total Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 38,036.00 27,455.00 33,677.00 47,943.00 39,592.00

Mimasu Semiconductor Industry Co Quarterly Data
Nov19 Feb20 May20 Aug20 Nov20 Feb21 May21 Aug21 Nov21 Feb22 May22 Aug22 Nov22 Feb23 May23 Aug23 Nov23 Feb24 May24 Aug24
Total Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 39,402.00 39,529.00 35,577.00 39,592.00 -

Mimasu Semiconductor Industry Co Total Liabilities Calculation

Total Liabilities are the liabilities that the company has to pay others. It is a part of the balance sheet of a company that shareholders do not own, and would be obligated to pay back if the company liquidated.

Mimasu Semiconductor Industry Co's Total Liabilities for the fiscal year that ended in May. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=38488+(974+130
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+0+0)
=39,592

Total Liabilities=Total Assets (A: May. 2024 )-Total Equity (A: May. 2024 )
=121181-81589
=39,592

Mimasu Semiconductor Industry Co's Total Liabilities for the quarter that ended in May. 2024 is calculated as

Total Liabilities=Total Current Liabilities+Total Noncurrent Liabilities
=Total Current Liabilities+(Long-Term Debt & Capital Lease Obligation+Other Long-Term Liabilities
=38488+(974+130
+NonCurrent Deferred Liabilities+PensionAndRetirementBenefit)
+0+0)
=39,592

Total Liabilities=Total Assets (Q: May. 2024 )-Total Equity (Q: May. 2024 )
=121181-81589
=39,592

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


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Mimasu Semiconductor Industry Co Business Description

Traded in Other Exchanges
N/A
Address
2174-1 Hododa-machi, Takasaki-shi, Gunma, JPN, 370-3533
Mimasu Semiconductor Industry Co Ltd is a Japan-based company, engages in the processing of semiconductor materials. The Semiconductor division includes processing and sales of semiconductor materials. The Industrial sales segment includes measuring instruments, testing machines, information equipment, automatic control equipment other precision equipment, in-house developed products, and related systems sales. The Engineering division is engaged in the provision of various automatic devices, such as processing equipment for semiconductor materials, robot systems, and others.

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